High-Frequency Module Layout to Shield Control IC From RF Noise
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Solution Overview
Problem
In high-frequency modules for mobile communication devices, the stacking of surface acoustic wave devices and semiconductor integrated circuits leads to deterioration of control characteristics due to high-frequency noise, affecting the performance of the semiconductor control IC.
Innovation Solution
The high-frequency module is configured with a semiconductor control IC stacked with a reception filter instead of a transmission filter, which reduces the impact of high-frequency noise and maintains compact size, while the integrated passive elements are strategically positioned to minimize noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a transmission filter and a semiconductor control IC are stacked, then the miniaturization of the high-frequency front-end circuit is achieved, but the control characteristics of the semiconductor control IC deteriorate due to high-frequency noise from the transmission filter
Solution Approach 1:
The patent extracts the harmful element (transmission filter) from the stacking configuration and replaces it with a reception filter. This selective removal of the noise-generating component while maintaining the stacking structure resolves the contradiction between miniaturization and control characteristic deterioration.
Solution Approach 2:
The patent converts the potentially harmful stacking configuration into a beneficial arrangement by using a reception filter instead of a transmission filter. The reception filter's lower noise characteristics transform what would have been a harmful noise source into a benign component that maintains compactness without degrading control IC performance.
2Adaptability or versatility
If the number of circuit elements is increased for multi-band use, then the functionality for multi-band communication is improved, but the device size increases
Solution Approach 1:
The patent merges multiple circuit elements (reception filter and semiconductor control IC) into a compact stacked configuration. This integration allows multi-band functionality to be achieved within a reduced footprint by combining components that would traditionally occupy separate spaces.
Solution Approach 2:
The patent transitions from a planar arrangement of circuit elements to a three-dimensional stacked configuration. By utilizing the vertical dimension for component placement, the design achieves multi-band functionality without increasing the horizontal footprint of the high-frequency module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the deterioration of control characteristics in the semiconductor control IC, enhancing the performance and reducing the size of the high-frequency module while maintaining multi-band compatibility.
Implementation Method 1
a reception filter for transmitting a reception signal having a smaller signal strength than a transmission signal
Implementation Method 2
a transmission filter for transmitting a transmission signal having a larger signal strength than a reception signal
Data Source
AI summary
A high-frequency module (1) includes a mounting substrate (90), a transmission filter (6MT) arranged on the mounting substrate (90), a reception filter (6MR) arranged on the mounting substrate (90), and a semiconductor control IC (40) arranged on the mounting substrate (90) and stacked with the reception filter (6MR) of the transmission filter (6MT) and the reception filter (6MR).