RF Module Board Layout to Reduce Switch-to-Matching Coupling
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Solution Overview
Problem
In miniaturized radio frequency modules, electromagnetic coupling between transmission selection switches and transmission output matching circuits can cause leakage of high-output transmission signals, leading to deterioration of signal quality in unselected transmission paths.
Innovation Solution
The radio frequency module is configured with first inductors in matching circuits disposed on one principal surface of the module board and switches on the opposite surface, reducing electromagnetic coupling by separating these components and utilizing a ground electrode layer for electromagnetic-field shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the radio frequency module is miniaturized by placing components on the same surface, then the module size is reduced, but electromagnetic coupling occurs between the transmission selection switch and transmission output matching circuit causing signal leakage
Solution Approach 1:
The patent applies dimensionality change by moving the transmission output matching circuit from the same surface as the transmission selection switch to the opposite surface of the module board. This spatial separation across different dimensions (front surface vs. back surface) effectively reduces electromagnetic coupling while maintaining module miniaturization. The matching circuit is positioned on the rear surface with its inductor element oriented to face the switch on the front surface, creating vertical separation that mitigates harmful electromagnetic interactions.
2Productivity
If the transmission selection switch and transmission output matching circuit are placed close together to reduce module size, then manufacturing efficiency is improved, but signal quality deteriorates due to electromagnetic coupling
Solution Approach 1:
The patent applies segmentation by dividing the module board into distinct functional zones: the front surface houses the transmission selection switch and related transmission path components, while the back surface accommodates the transmission output matching circuit. This spatial segmentation separates components that would otherwise interfere with each other, allowing both to be manufactured in close proximity without compromising signal quality. The ground electrode layer further segments the electromagnetic fields between the two surfaces.
Solution Approach 2:
The patent introduces a ground electrode layer as an intermediary between the transmission selection switch on the front surface and the transmission output matching circuit on the back surface. This ground layer acts as an electromagnetic shield, blocking harmful coupling while allowing the components to remain in close proximity for compact manufacturing. The ground electrode serves as a mediator that enables close placement without signal quality degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively minimizes signal leakage and improves signal quality by reducing electromagnetic coupling, enabling the development of miniaturized radio frequency modules with enhanced performance.
Implementation Method 1
electromagnetic coupling may occur between the transmission selection switch connected to the plurality of transmission paths and the transmission output matching circuit
Data Source
AI summary
A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a transmission power amplifier configured to amplify a transmission signal; a first switch; and a first inductor included in a matching circuit connected between an output terminal of the transmission power amplifier and the first switch. The first inductor is disposed on the first principal surface, and the first switch is disposed on the second principal surface.