Automated RF Module Defect Detection via PCB Image Comparison
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Solution Overview
Problem
The challenge in the manufacturing of packaged radio-frequency modules is the identification of potentially defective units, which can be caused by impurities, scratches, or other physical damage during the fabrication and packaging process, leading to monetary and resource losses, as well as reduced yield due to the need for manual identification and separation.
Innovation Solution
A system and method that includes capturing images of Printed Circuit Boards (PCBs), comparing them to a PCB recipe, and using a mapping module to identify and mark potentially defective modules, which can be done using ink or a laser to create a map for subsequent separation, thereby reducing the introduction of impurities and improving the efficiency of the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated image capture and comparison systems are implemented to identify defective modules, then productivity and manufacturing precision are improved, but device complexity increases
Solution Approach 1:
The patent uses image capture to create a visual copy of the PCB and module substrates, then compares this copy against the PCB recipe (expected configuration). This allows automated defect detection without physically handling or moving the actual modules, thereby improving productivity while keeping the physical system relatively simple.
Solution Approach 2:
The patent replaces manual visual inspection and physical handling of modules with an automated optical imaging and image processing system. The image capture module and image processor substitute for human operators, enabling automated defect identification that improves productivity and consistency without requiring complex mechanical manipulation systems.
2Productivity
If manual identification and separation of defective modules is performed, then device complexity is reduced, but productivity decreases and impurity introduction increases
Solution Approach 1:
The patent extracts the defect identification function from the physical handling process. By using image capture and image processing to identify defective modules, the system separates the detection function from physical manipulation, allowing defective modules to be identified without being touched or moved, thus preventing impurity introduction while maintaining high productivity.
Solution Approach 2:
The patent introduces an intermediary system consisting of the image capture module and image processor that mediates between the PCB and the final separation action. This intermediary allows defect identification to occur at a distance, preventing direct contact between operators and modules, thereby reducing impurity introduction while maintaining efficient throughput.
Data Source
AI summary
Systems and methods for identifying defective individual packaged modules are presented. A Printed Circuit Board (PCB) having a set of individual module substrates can be received. Further, capturing an image of the PCB and loading a PCB recipe associated with the PCB can be performed. The image of the PCB can be captured by an image capture module that can include one or more cameras. For each individual module substrate, a portion of the image corresponding to the individual module substrate can be compared to the PCB recipe. In addition, it can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. In response to determining that the individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.