High-Frequency Module Diplexer Switching for Multi-Band Size Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing high-frequency modules are larger and more costly due to the inclusion of multiple frequency bands, which increases the size and complexity of wireless mobile units.
Innovation Solution
A high-frequency module is designed with a first circuit for a first frequency band and a second circuit for a second frequency band, integrated with a high-frequency switch, diplexer, and multiple external connection terminals, allowing for selective connections and reduced component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple frequency bands are handled using separate modules, then frequency band coverage is improved, but module size and cost increase
Solution Approach 1:
The patent combines multiple frequency band handling circuits into a single integrated module. The first circuit handles the first frequency band while the second circuit handles the second frequency band, both within one module structure. This merging approach maintains multi-band coverage capability while reducing the overall module size compared to using separate modules for each frequency band.
Solution Approach 2:
The module is designed with universal functionality to handle multiple frequency bands through a shared structure. The high-frequency switch and diplexer enable the module to selectively process different frequency bands (first and second bands) through common components like the first receiving unit, first transmitting unit, and shared antenna connections, achieving multi-functionality within a single module.
2Adaptability or versatility
If multiple frequency bands are handled using separate modules, then frequency band coverage is improved, but manufacturing cost increases
Solution Approach 1:
By merging multiple frequency band handling capabilities into a single module with shared components (high-frequency switch, diplexer, receiving units, transmitting units), the patent reduces the total component count and assembly complexity. This integration lowers manufacturing costs compared to producing and assembling separate modules for each frequency band.
Solution Approach 2:
The module employs universal components that can process multiple frequency bands. The high-frequency switch and diplexer are designed to handle both the first and second frequency bands, eliminating the need for separate dedicated components for each band and thereby reducing overall manufacturing costs while maintaining multi-band coverage.
3Adaptability or versatility
If multiple antennas and circuits are used for different frequency bands, then frequency band coverage is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple circuit functions into a unified structure where the first circuit and second circuit share common components. The high-frequency switch integrates multiple switching functions, and the diplexer combines signal routing for different frequency bands, reducing the total number of discrete components while maintaining the ability to handle multiple frequency bands.
Solution Approach 2:
The module uses universal components with multi-functional capabilities. The high-frequency switch can route signals for both the first and second frequency bands, and the diplexer handles signal separation and combination for multiple bands. This universality reduces device complexity by eliminating the need for separate dedicated components for each frequency band.
Data Source
AI summary
A first circuit that inputs/outputs a first frequency band and a second circuit that inputs/outputs a second frequency band are included. A first receiving unit in the first circuit is connected to a first external connection terminal or a second external connection terminal with a band pass filter and a first switch in a high-frequency switch. A first transmitting unit or a second receiving unit in the first circuit is connected with a second switch in the high-frequency switch. The second switch is connected to a diplexer connected to a third external connection terminal. A second transmitting unit in the second circuit is connected to the diplexer or a fourth external connection terminal with a third switch in the high-frequency switch. A third receiving unit or a fourth receiving unit in the second circuit is connected to the fourth external connection terminal with the third switch.