RF Module Dual-Face Switch IC for Multiband Isolation
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Solution Overview
Problem
In multiband radio-frequency front end circuits, achieving high signal quality across multiple frequency bands is hindered by radio-frequency coupling and increased propagation loss due to the high-density mounting of electronic components on wiring substrates, which degrades isolation between signal paths.
Innovation Solution
A multiband radio-frequency module configuration with a switch IC having connection electrodes on both main faces, allowing signal lines and electronic components to be arranged on separate mounting faces, reducing coupling and propagation loss by shortening signal paths and improving isolation between frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple electronic components are arranged on the wiring substrate with high density to realize multiband radio-frequency front end circuit, then the signal quality of multiple frequency bands is improved, but radio-frequency coupling occurs in the lines in the wiring substrate which degrades isolation between different signal paths
Solution Approach 1:
The patent divides the mounting substrate into multiple mounting faces (first mounting face and second mounting face) and segments the electronic components accordingly. The switch IC is mounted on the first mounting face while other electronic components are mounted on the second mounting face, physically separating different signal paths to reduce radio-frequency coupling between them.
2Reliability
If multiple electronic components are arranged on the wiring substrate with high density to realize multiband radio-frequency front end circuit, then the signal quality of multiple frequency bands is improved, but the routing length of the lines is increased to increase propagation loss
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of components on a single substrate face to a three-dimensional configuration utilizing multiple mounting faces. By placing the switch IC on the first mounting face and other components on the second mounting face, the signal paths are shortened as components are positioned closer to their signal sources, thereby reducing propagation loss.
3Object-generated harmful factors
If connection electrodes are arranged on both faces of the switch IC, then the signal lines can be formed on separate mounting faces improving isolation, but the device complexity is increased
Solution Approach 1:
The switch IC is designed with universal connection electrodes on both its first and second main faces, allowing it to serve multiple functions: connecting to signal lines on the first mounting face and simultaneously connecting to other components on the second mounting face. This multi-functional design improves isolation between signal paths without proportionally increasing device complexity.
Data Source
AI summary
An RF module includes a switch IC having connection electrodes on a first main face and connection electrodes on a second main face; a mounting substrate which has a first mounting face at the first main face side and a second mounting face at the second main face side and in which the switch IC is mounted; signal lines for a band A, which are formed at the first mounting face side of the mounting substrate; signal lines for a band B, which are formed at the second mounting face side of the mounting substrate; a band A filter; and a band B filter. Among the band A filter and the band B filter, only the band A filter is mounted on the first mounting face and only the band B filter is mounted on the second mounting face.