RF Module Ground Shield Layout for Duplexer Isolation
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Solution Overview
Problem
Existing radio frequency modules face challenges in achieving isolation between stacked components on a substrate, particularly when a third component is added, leading to interference and degradation of signal quality.
Innovation Solution
The implementation of a metallic body connected to the ground and disposed between stacked components on a substrate, which improves isolation by suppressing interference between duplexers in different communication bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a third component is disposed on the substrate in addition to the output matching network device and band select switch, then the functionality and versatility of the radio frequency module are improved, but the isolation between the stacked components and the third component deteriorates
Solution Approach 1:
A ground electrode is disposed between the stacked components (output matching network device and band select switch) and the third component on the substrate. This ground electrode acts as an intermediary shielding element that blocks electromagnetic interference between the stacked components and the third component, allowing multiple components to coexist on the substrate without mutual interference.
2Volume of moving object
If multiple components are stacked on the substrate to reduce module size, then the compactness is improved, but the isolation between stacked components and other components deteriorates
Solution Approach 1:
The ground electrode serves as a shielding intermediary positioned between the stacked components and the third component, enabling compact vertical stacking while preventing electromagnetic interference from affecting adjacent components on the substrate.
Solution Approach 2:
The ground electrode provides localized electromagnetic shielding at the specific region where stacked components are disposed on the substrate, creating an isolated electromagnetic environment for the stacked components without affecting other areas of the module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal quality by reducing interference between duplexers, allowing simultaneous transmission and reception in multiple communication bands while maintaining effective isolation.
Implementation Method 1
a metallic body connected to a ground... in plan view, the metallic body is disposed between the first component and the third component
Data Source
AI summary
A radio frequency module includes a substrate having a first major surface and a second major surface that face each other, a first component disposed on or over the first major surface of the substrate, a second component disposed on the first component, a third component disposed on or over the first major surface of the substrate, and a metallic body connected to a ground. One end of the metallic body is connected to the first major surface of the substrate; and in plan view, the metallic body is disposed between the first component and the third component.