RF Module Electrode Overlap Layout for More External Connections
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Solution Overview
Problem
Conventional radio-frequency modules have limited external connection terminals due to the placement of second electronic components on the second main surface of the mounting substrate, restricting the number of terminals that can be included for external connections.
Innovation Solution
A radio-frequency module design featuring a mounting substrate with first and second main surfaces, where the first electronic components are on the first surface, the second electronic components are on the second surface, and a plurality of connection terminals and external connection electrodes are on the second surface, with the external connection electrodes overlapping the second electronic components, allowing for a greater number of external connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second electronic component is disposed on the second main surface of the mounting substrate, then the component can be properly mounted and connected, but the number of external connection terminals is limited
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of terminals on the second main surface to a three-dimensional configuration by introducing a wiring layer that extends in the thickness direction. External connection electrodes are formed on both the first and second main surfaces of the mounting substrate, utilizing the Z-axis dimension to increase terminal capacity without compromising the mounting space for the second electronic component.
Solution Approach 2:
The wiring layer is nested within the mounting substrate structure, with external connection electrodes positioned on both surfaces of the substrate. This nested configuration allows the terminal connections to be integrated within the substrate's thickness, effectively doubling the available terminal locations without increasing the substrate's footprint or interfering with component mounting.
2Adaptability or versatility
If more external connection terminals are added to the second main surface, then connectivity is improved, but the substrate thickness must be increased
Solution Approach 1:
Instead of increasing substrate thickness to accommodate more terminals on the second main surface, the patent utilizes the surface dimension by forming external connection electrodes on both the first and second main surfaces. This approach distributes terminals across two surfaces, achieving high connectivity without requiring increased substrate thickness.
Solution Approach 2:
The external connection terminals are segmented and distributed across two separate surfaces of the mounting substrate rather than concentrating them all on the second main surface. This segmentation allows for high connectivity while maintaining a thin substrate profile, as terminals are divided between the first and second surfaces.
Data Source
AI summary
A radio frequency module includes a mounting substrate including a first main surface and a second main surface opposite to the first main surface. A first electronic component is disposed on the first main surface of the mounting substrate. A second electronic component is disposed on the second main surface of the mounting substrate. A plurality of connection terminals are disposed on the second main surface of the mounting substrate. A wiring layer faces the second main surface of the mounting substrate. The wiring layer includes a plurality of external connection electrodes, each connected to at least one of the second electronic component and the plurality of connection terminals. At least one of the plurality of external connection electrodes overlaps the second electronic component when viewed in plan in a thickness direction of the substrate.