RF Module Layout With Embedded Coupler for Lower Transmission Loss
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Solution Overview
Problem
The large number of components in hybrid acoustic LC filters and couplers in radio-frequency modules leads to increased transmission loss due to elongated wiring lines, necessitating a reduction in module size and loss.
Innovation Solution
The radio-frequency module integrates a substrate with a semiconductor IC that overlaps the acoustic wave resonator and coupler, distributing components across both main surfaces to minimize wiring length and transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hybrid acoustic LC filter and coupler are disposed in a radio-frequency module, then signal filtering and measurement functionality are improved, but the number of components increases leading to larger disposition area and elongated wiring lines
Solution Approach 1:
The patent embeds the coupler inside the substrate, nesting it within the existing module structure rather than placing it as a separate external component. This nesting approach allows the coupler to share space with other module components, reducing the overall disposition area while maintaining the required signal filtering and measurement functionality
Solution Approach 2:
The patent transitions from a two-dimensional surface mounting arrangement to a three-dimensional internal embedding arrangement by placing the coupler inside the substrate. This dimensional change allows components to be arranged in vertical layers rather than only horizontal planes, reducing the footprint area occupied by the module
2Reliability
If a hybrid acoustic LC filter and coupler are disposed in a radio-frequency module, then signal filtering and measurement functionality are improved, but wiring line length increases leading to increased transmission loss
Solution Approach 1:
By nesting the coupler inside the substrate, the patent minimizes the physical distance between the coupler and other signal path components. This reduced spacing directly shortens the wiring lines connecting these components, thereby reducing transmission loss while maintaining the necessary signal filtering functionality
Solution Approach 2:
The substrate itself acts as an intermediary structure that integrates and interconnects the coupler, acoustic wave resonator, and other components. This intermediary approach provides optimized signal pathways through the substrate material, reducing transmission loss compared to external wiring connections
3Adaptability or versatility
If multiple components are disposed on the substrate surface, then functionality is improved, but the disposition area increases
Solution Approach 1:
The patent utilizes the third dimension by embedding the coupler inside the substrate rather than mounting all components on the surface. This vertical arrangement allows multiple functional components to coexist in a compact footprint, maintaining versatile functionality while reducing the horizontal module size
Solution Approach 2:
The patent merges the coupler with the substrate structure, combining what could be separate surface-mounted components into an integrated assembly. This merging reduces the total disposition area by eliminating gaps and spacing requirements between separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces transmission loss and power consumption while maintaining the functionality of hybrid filters and couplers, enabling efficient signal processing.
Implementation Method 1
a first hybrid filter having a first acoustic wave resonator
Data Source
AI summary
A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, a switch for connecting and disconnecting an antenna connection terminal and the hybrid filter, and a coupler disposed on a path linking the antenna connection terminal and the switch. The first acoustic wave resonator is disposed on the main surface, the switch is included in a semiconductor IC disposed on the main surface, the coupler is disposed inside the module substrate, and in plan view of the module substrate, the semiconductor IC at least partially overlaps the first acoustic wave resonator, and the semiconductor IC and the coupler at least partially overlaps.