RF Module Layout for Digital ET Amplifier Efficiency

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Solution Overview

Problem

Existing radio frequency (RF) modules face efficiency degradation and increased power consumption when digital Envelope Tracking (ET) is applied, particularly due to the arrangement of amplifiers and digital ET tracker circuits.

Innovation Solution

A radio frequency module design with multiple power amplifiers connected to antennas, each with dedicated supply modulators and integrated circuits, where the distance between amplifiers and their respective integrated circuits is optimized to minimize efficiency loss and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If digital ET tracker circuit is integrated with amplifier in conventional arrangement, then signal amplification function is achieved, but efficiency deteriorates and power consumption increases

Engineering Contradiction:
Improvesignal amplification efficiencyVSAvoidpower consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The patent divides the RF module into separate functional units: power amplifiers (first and second) are spatially separated from the digital ET tracker circuit (integrated circuits). This segmentation allows each component to be optimized independently and reduces parasitic effects from interconnections, thereby improving amplification efficiency and reducing power consumption.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces dedicated supply modulators as intermediary components between the digital ET tracker circuit and the power amplifiers. These supply modulators condition the power supply signals, optimizing the transfer of control signals while minimizing energy loss and improving overall system efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If distance between amplifier and integrated circuit is reduced, then efficiency degradation is suppressed, but device complexity increases

Engineering Contradiction:
Improvetracker circuit efficiencyVSAvoidcircuit arrangement complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating dedicated proximity relationships: the first integrated circuit is positioned close to the first power amplifier, and the second integrated circuit is positioned close to the second power amplifier. This localized arrangement minimizes interconnection lengths and parasitic effects for each amplifier-tracker pair while maintaining overall system manageability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent segments the RF module into multiple independent amplifier-tracker units, each with its own dedicated integrated circuit and supply modulator. This segmentation allows each unit to be optimized locally for minimal distance between components, suppressing efficiency degradation without requiring complete redesign of the entire system.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20250392329A1Radio frequency module
Publication Date: 2025.12.25 MURATA MFG CO LTD
  • US20250392329A1 patent drawing
  • US20250392329A1 patent drawing
  • US20250392329A1 patent drawing

AI summary

A radio frequency module is provided that includes first and second power amplifiers that amplify a WLAN signal in a first frequency band, a voltage generation circuit that generates multiple discrete voltages, a supply modulator connected between the power amplifier and the voltage generation circuit and selectively outputs one of the multiple discrete voltages, another supply modulator connected between the power amplifier and the voltage generation circuit and selectively outputs one of the multiple discrete voltages, and first and second integrated circuits that each include a switch of one of the supply modulators. A distance between the first power amplifier and the first integrated circuit is shorter than a distance between the first power amplifier and the second integrated circuit, and a distance between the second power amplifier and the second integrated circuit is shorter than a distance between the second power amplifier and the first integrated circuit.