RF Module Filter Layout for Higher Input-Output Isolation
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Solution Overview
Problem
Existing radio-frequency modules with multiple filters have low isolation between input and output terminals, which affects signal integrity and performance, especially when multiple filters with different frequency bands are discretely mounted on a substrate.
Innovation Solution
A radio-frequency module design where filters with different frequency bands are arranged such that their input terminals are centered and output terminals are positioned between the filters and the module's perimeter, with an integrated circuit component connected to both, enhancing isolation through optimized layout and component placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If filters are discretely mounted on the first principal surface and IC component is mounted on the second principal surface, then all filters can be included in the module, but the isolation between input and output terminals of each filter becomes low
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked arrangement by mounting filters on the first principal surface and the IC component on the second principal surface of the substrate. This vertical stacking enables inclusion of multiple filters while maintaining isolation through spatial separation in the thickness direction.
Solution Approach 2:
The patent implements a nested structure where the IC component is positioned within the projection area of the filters when viewed from the thickness direction, or the filters are positioned within the projection area of the IC component. This nested arrangement allows compact integration while maintaining electrical isolation between input and output terminals through the substrate thickness.
2Ease of operation
If filters are discretely located away from each other, then each filter can be individually connected, but the degree of isolation between input and output terminals of each filter is low
Solution Approach 1:
The patent uses the thickness direction of the substrate as an additional dimension to achieve isolation. By connecting input terminals to one surface and output terminals to the opposite surface, the patent creates natural electrical isolation through the substrate material, eliminating the need for complex lateral separation arrangements.
Solution Approach 2:
The substrate acts as an intermediary element that provides both mechanical support and electrical isolation. The substrate material between the first and second principal surfaces serves as an insulating barrier, isolating input and output terminals while allowing individual connection of each filter to the appropriate terminals.
Data Source
AI summary
When a radio-frequency module is viewed in plan in a thickness direction of a mounting substrate, an electronic component overlaps an IC component. The electronic component includes four or more filters, each of which includes an input terminal and an output terminal. The IC component includes a first switch connected to the input terminals of at least four of the four or more filters and a second switch connected to the output terminals of the at least four filters. The input terminals of the at least four filters are in a first region including a center of the electronic component when viewed in plan in the thickness direction of the mounting substrate. The output terminals of the at least four filters are in a second region between the first region and a perimeter of the electronic component when viewed in plan in the thickness direction of the mounting substrate.