RF Module Filter Layout for Heat Dissipation and Shielding
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Solution Overview
Problem
The integration of first and second transmission filters into a single chip in existing radio-frequency modules leads to reduced heat dissipation and compromised performance.
Innovation Solution
A radio-frequency module design that includes a mounting substrate with a first and second transmission filter mounted on opposite surfaces, utilizing a common substrate and a metallic member at ground potential to enhance heat dissipation by arranging it between input and output terminals or functional electrodes, and incorporating a shield layer for electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the first transmission filter and the second transmission filter are integrated into one chip, then device complexity is reduced, but heat dissipation deteriorates
Solution Approach 1:
The patent divides the integrated filter chip into two separate filter units (first transmission filter and second transmission filter) that are mounted on different main surfaces of the module substrate. This segmentation allows each filter to have independent heat dissipation paths, resolving the heat dissipation deterioration caused by integration while maintaining reduced device complexity through shared substrate infrastructure.
2Manufacturing precision
If the first transmission filter and the second transmission filter are integrated into one chip, then manufacturing precision requirements are reduced, but characteristics deteriorate
Solution Approach 1:
By segmenting the filters into separate units mounted on different surfaces of the module substrate, each filter can be manufactured and tested independently with standard precision requirements. This eliminates the need for high-precision integration tolerances while maintaining excellent filter characteristics through independent optimization of each filter unit.
3Temperature
If the metallic member is arranged between input terminals and output terminals, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The metallic member is designed to serve multiple functions simultaneously: it acts as a heat dissipation path for both the first and second transmission filters, provides electromagnetic shielding between the filters, and serves as a grounding structure. This multi-functionality improves heat dissipation while avoiding additional device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation and maintains performance by effectively dissipating heat generated by the transmission filters through the metallic member and shield layer, enhancing the module's operational efficiency.
Implementation Method 1
the metallic member is arranged at least at one of between the first input terminal and the second input terminal and between the first output terminal and the second output terminal in a side view
Implementation Method 2
incorporating a shield layer for electromagnetic shielding
Data Source
AI summary
In a radio-frequency module, an electronic component includes a first transmission filter, a second transmission filter, a first input terminal and a first output terminal, and a second input terminal and a second output terminal. The first input terminal is connected to an input end of a signal path of the first transmission filter. The second input terminal is connected to an input end of a signal path of the second transmission filter. The first transmission filter includes a first substrate. The second transmission filter includes a second substrate. The first substrate and the second substrate are common. The electronic component further includes a metallic member at ground potential. In the electronic component, the metallic member is arranged between the first input terminal and the second input terminal in a side view.