RF Module Board Gap Layout for Temperature-Cycle Stability

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Solution Overview

Problem

Radio-frequency modules experience degradation of characteristics under temperature cycling conditions due to heat generation.

Innovation Solution

A radio-frequency module design with a mounting board featuring gaps between external connection terminals and electronic components, positioned to reduce thermal stress by allowing deformation and cushioning during temperature changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If electronic components and external connection terminals are closely integrated on the mounting board, then device compactness is improved, but thermal stress and characteristic degradation under temperature cycling conditions worsen

Engineering Contradiction:

Improvemodule sizeVSAvoidcharacteristic stability under temperature cycling

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The mounting board is divided into multiple regions (first region for external connection terminals, second region for electronic components) separated by gaps. This segmentation isolates thermally sensitive components from heat-generating terminals, reducing thermal stress while maintaining compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Gaps are introduced as intermediary spaces between the first region containing external connection terminals and the second region containing electronic components. These gaps act as thermal buffers that reduce heat transfer and thermal stress on sensitive components during temperature cycling.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If gaps are introduced between regions on the mounting board, then thermal stress is reduced, but device complexity increases

Engineering Contradiction:

Improvecharacteristic stability under temperature cyclingVSAvoidmounting board structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Suppresses degradation of characteristics under temperature cycling conditions by reducing thermal stress through strategic gap placement and material selection.

Implementation Method 1

heat generated in the radio-frequency module can degrade characteristics under temperature cycling conditions

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12556209B2Radio-frequency module and communication device

Publication Date: 2026.02.17 MURATA MFG CO LTD

AI summary

A radio-frequency module includes a mounting board, a plurality of electronic components (for example, first matching circuits, filters, and second matching circuits, and a plurality of external connection terminals. The plurality of external connection terminals include a first external connection terminal. The mounting board has a first region and a second region. A gap is formed between the first region and the second region at a second major surface. The first external connection terminal is surrounded by an edge of the mounting board and the gap when viewed in plan view in a thickness direction of the mounting board.