High-Frequency Module Gap Structure for Thermal Stress Relief

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Solution Overview

Problem

High frequency modules experience stress due to thermal expansion and contraction, which existing technologies have not adequately addressed, leading to potential structural issues and performance degradation.

Innovation Solution

Incorporating a gap structure within the high frequency module between the circuit component, resin layer, and shield layer, as well as inside these components, to absorb and reduce thermal stress, with the resin layer covering the circuit component and the shield layer covering the resin layer and circuit component, thereby mitigating stress effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the resin layer and shield layer are formed to cover the circuit component without gaps, then the structural integrity and electromagnetic shielding are improved, but thermal stress accumulates causing potential structural issues and performance degradation

Engineering Contradiction:

Improvestructural integrityVSAvoidthermal stress resistance

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent introduces gaps that segment the continuous resin layer and shield layer structures. These gaps divide the stress distribution areas, preventing stress accumulation while maintaining overall structural integrity. The segmentation allows different regions to expand and contract independently during thermal cycles.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The gaps are pre-designed into the structure before the module operates, serving as cushioning spaces that absorb thermal stress before it can cause damage. This beforehand cushioning prevents structural issues and performance degradation by providing stress relief pathways in advance.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If gaps are introduced to reduce thermal stress, then thermal stress resistance is improved, but the structural integrity and electromagnetic shielding effectiveness may be compromised

Engineering Contradiction:

Improvethermal stress resistanceVSAvoidstructural integrity

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The gaps are strategically positioned at specific locations where thermal stress accumulates most, rather than uniformly distributed. This local quality approach maintains structural integrity in critical areas while providing stress relief where needed. The shield layer configuration also varies locally to maintain shielding effectiveness despite the presence of gaps.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The module employs a composite structure combining the resin layer, shield layer, and gap spaces into an integrated stress-management system. This composite approach allows each material to fulfill its primary function while collectively providing both structural integrity and thermal stress resistance.

Inventive Principle:

Principle #40Composite materials

3Object-affected harmful factors

If the shield layer completely covers the resin layer and circuit component, then electromagnetic shielding is improved, but manufacturing complexity and potential stress concentration increase

Engineering Contradiction:

Improveelectromagnetic interference protectionVSAvoidmanufacturing complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The shield layer is segmented into regions separated by gaps, simplifying the manufacturing process by allowing modular assembly and reducing the complexity of forming a completely continuous shield. The segmentation also reduces stress concentration points during assembly and operation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The gap structure effectively reduces stress generated by thermal expansion and contraction, enhancing the structural integrity and performance of the high frequency module by absorbing thermal stress and preventing cracks in the shield and circuit components.

Implementation Method 1

the stress generated by the thermal expansion and contraction or the like inside the high frequency module

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

the stress generated by the thermal expansion and contraction or the like inside the high frequency module

Methodology Applied

Scientific EffectThermal contraction: Thermal Contraction

Data Source

PatentUS20230328877A1High frequency module and communication apparatus

Publication Date: 2023.10.12 MURATA MFG CO LTD

AI summary

The high frequency module includes a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The circuit component is mounted on the first main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers at least part of an outer peripheral surface of the circuit component. The shield layer covers at least part of the resin layer and a main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at at least one of a position between the circuit component and the resin layer, a position between the circuit component and the shield layer, a position inside the resin layer, and a position inside the shield layer.