RF Front-End Module Groove Bonding for EMI Shielding
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Solution Overview
Problem
The manufacturing cost of radio frequency front-end modules is high due to expensive wafer-level packaging processes, and additional electromagnetic shielding structures are required, increasing complexity and cost.
Innovation Solution
A radio frequency front-end module design featuring a first and second base substrate with a groove structure, where the first radio frequency front-end component is partially located in the groove, and a bonding metal layer provides both bonding and shielding functions, eliminating the need for wafer-level packaging and extra shielding structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafer-level packaging process is used, then bonding function is achieved, but manufacturing cost increases
Solution Approach 1:
The bonding metal layer integrates both bonding and electromagnetic shielding functions into a single structure. The first metal portion provides bonding between substrates while the second metal portion provides electromagnetic shielding, eliminating the need for separate wafer-level packaging process and additional shielding structures, thereby reducing manufacturing cost while maintaining bonding reliability
Solution Approach 2:
The bonding metal layer is designed as a multi-functional component that simultaneously performs bonding and electromagnetic shielding. By making the bonding metal layer extend beyond the groove to form a second metal portion, it serves dual purposes: bonding the substrates together and providing electromagnetic interference shielding, thus reducing the number of manufacturing steps and costs
2Object-affected harmful factors
If extra shielding structure is added, then electromagnetic interference shielding function is achieved, but device complexity increases
Solution Approach 1:
The bonding metal layer is designed to extend beyond the groove to form a second metal portion that provides electromagnetic shielding. This integration of shielding function into the existing bonding structure eliminates the need for separate shielding components, reducing device complexity while achieving effective electromagnetic interference shielding
Solution Approach 2:
The bonding metal layer serves multiple functions: the first metal portion bonds the substrates while the second metal portion provides electromagnetic shielding. This multi-functionality approach consolidates what would traditionally require separate components into a single integrated structure, simplifying the overall device design
3Volume of moving object
If wafer-level packaging and shielding structure are omitted, then product size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
By integrating bonding and shielding functions into the bonding metal layer, the patent eliminates the need for separate wafer-level packaging and shielding structures. This consolidation reduces the overall product size while the groove structure provides natural positioning and alignment features that maintain manufacturing precision without requiring additional packaging layers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing costs, simplifies the module structure, and miniaturizes the product while achieving both bonding and electromagnetic interference shielding functions.
Implementation Method 1
the second metal portion is bonded with the metal bonding structure
Implementation Method 2
the first radio frequency front-end module is at least partially surrounded by the first metal portion, and the second metal portion is bonded with the metal bonding structure, so that the radio frequency front-end module can not only achieve the bonding function, but also achieve the electromagnetic interference shielding function
Data Source
AI summary
A radio frequency front-end module, a manufacturing method thereof and a communication device are provided. The radio frequency front-end module includes a first base substrate and a metal bonding structure; a second functional substrate, including a second base substrate, a groove in the second base substrate, and a bonding metal layer; and a first radio frequency front-end component, at least partially located in the groove, the first base substrate and the second base substrate are oppositely arranged, and a surface of the second base substrate close to the first base substrate includes a groove surface inside the groove and a substrate surface outside the groove, and the bonding metal layer includes a first metal portion located on the groove surface and a second metal portion located on the substrate surface, the first radio frequency front-end component is at least partially surrounded by the first metal portion.