RF Module Ground Conductor Segmentation for Signal Leakage
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Solution Overview
Problem
Existing radio frequency modules with amplifying circuits on multilayer substrates face signal leakage issues from the amplifying circuit to the bias circuit, leading to degradation in amplification characteristics and oscillation, which are not fully prevented by current ground conductor configurations.
Innovation Solution
A radio frequency module with physically separated ground conductor patterns for the amplifying and power supply circuits on internal layers of the multilayer substrate, with the option to extend these patterns to the outermost layer for further signal attenuation, and potentially dividing these patterns into portions for the input and output matching circuits and power supply circuits, along with via conductors acting as shields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single ground conductor pattern is provided in the multilayer substrate, then the ground potential is established and noise shielding is achieved, but signal leakage from the amplifying circuit to the bias circuit occurs causing degradation in amplification characteristics and oscillation
Solution Approach 1:
The ground conductor pattern is divided into a first ground conductor pattern for the amplifying circuit and a second ground conductor pattern for the bias circuit, which are physically separated from each other in the multilayer substrate. This segmentation prevents signal leakage from the amplifying circuit to the bias circuit while maintaining effective grounding for both circuits, thereby improving amplification characteristics and eliminating oscillation issues.
2Reliability
If the ground conductor pattern is extended to the outermost layer, then signal leakage prevention is enhanced through increased path length, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The ground conductor patterns are configured in internal layers of the multilayer substrate rather than extending to the outermost layer. By utilizing the vertical dimension and internal layer structure, the patent achieves effective signal leakage prevention through physical separation of the first and second ground conductor patterns while avoiding the increased complexity and manufacturing difficulty associated with outermost layer configurations.
Data Source
AI summary
A radio frequency module includes: a multilayer substrate that includes a plurality of insulator layers; an amplifying circuit that is provided on the multilayer substrate and amplifies a radio frequency signal; a power supply circuit that is provided on the multilayer substrate and supplies power to the amplifying circuit; a ground conductor that is a first conductor pattern having a ground potential and used in the amplifying circuit; and a ground conductor that is a second conductor pattern having a ground potential and used in the power supply circuit. The ground conductors are physically separated from each other and provided in internal layers of the multilayer substrate.