RF Module Layout for Tx/Rx Isolation via Ground Shielding
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Solution Overview
Problem
The existing RF modules suffer from degradation of isolation between transmission and reception due to electromagnetic coupling, leading to harmonic interference and intermodulation distortion, which degrades reception sensitivity.
Innovation Solution
The RF module design includes a module substrate with a power amplifier for transmission signals and a low-noise amplifier for reception signals, featuring switches and conductive components strategically placed on opposite surfaces to suppress electromagnetic coupling, with ground terminals and conductive components intervening between switches to block electromagnetic fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the transmission amplifier circuit and reception amplifier circuit are placed close to each other on the module substrate, then the device complexity is reduced and integration is improved, but electromagnetic coupling occurs between the circuits causing degradation of isolation between transmission and reception
Solution Approach 1:
A ground terminal is introduced as an intermediary element positioned between the transmission amplifier circuit and reception amplifier circuit on the module substrate. This ground terminal acts as a mediator to block electromagnetic coupling between the two circuits, preventing harmful interference while allowing the circuits to remain integrated on the same substrate.
Solution Approach 2:
The module substrate is segmented into distinct regions by positioning the ground terminal between the transmission and reception amplifier circuits. This segmentation creates electromagnetic isolation zones that prevent coupling interference while maintaining the overall integrated structure of the device.
2Power
If high-power transmission signals are amplified in the transmission amplifier circuit, then the transmission power is increased, but harmonics and intermodulation distortion are generated that can flow into the reception amplifier circuit through electromagnetic coupling
Solution Approach 1:
The ground terminal serves as a protective intermediary that blocks the path of harmful harmonics and intermodulation distortion generated by high-power transmission amplification. By positioning the ground terminal between the transmission and reception circuits, it prevents these harmful factors from coupling into the sensitive reception amplifier circuit.
Solution Approach 2:
The ground terminal is positioned in advance between the transmission and reception circuits to preemptively block electromagnetic coupling before harmful harmonics and intermodulation distortion can propagate from the high-power transmission circuit to the reception circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses electromagnetic coupling, preventing harmonic interference and intermodulation distortion, thereby enhancing isolation and maintaining reception sensitivity.
Implementation Method 1
the transmission amplifier circuit and the reception amplifier circuit may electromagnetically couple to each other
Implementation Method 2
a first conductive component disposed in a region that is on the second principal surface and that is between the first switch and the second switch
Data Source
AI summary
A radio-frequency module includes a module substrate having a first principal surface and a second principal surface on opposite sides of the module substrate, a power amplifier capable of amplifying a transmission signal, a low-noise amplifier capable of amplifying a reception signal, a first switch connected to an input terminal of the power amplifier and disposed on the second principal surface, a second switch connected to an output terminal of the low-noise amplifier and disposed on the second principal surface, and a first ground terminal disposed in a region that is on the second principal surface and that is between the first switch and the second switch in plan view of the module substrate.