RF Module Isolation via Ground Terminal Placement

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Solution Overview

Problem

In radio frequency modules, the proximity of circuit elements for transmission and reception signals can lead to isolation issues due to their close placement on the substrate, affecting the module's performance and size.

Innovation Solution

The radio frequency module design includes a mounting substrate with circuit elements for transmission and reception signals mounted on opposite surfaces, with external connection terminals, including a ground terminal positioned between them, to improve isolation and reduce size by allowing flexible layout.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If circuit elements for transmission and reception signals are mounted close together on the substrate, then the module size is reduced, but isolation between the circuit elements deteriorates

Engineering Contradiction:
Improvemodule sizeVSAvoidisolation between circuit elements
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent positions the ground terminal at a different spatial location between the transmission and reception circuit elements, utilizing the two-dimensional layout space on the substrate to achieve optimal isolation without increasing module footprint. This dimensional arrangement allows compact placement while maintaining electrical isolation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The ground terminal serves as an intermediary element positioned between the transmission circuit element and reception circuit element. This intermediate component provides electrical isolation and shielding, preventing signal interference while allowing the circuit elements to remain in close proximity for compact module design.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If circuit elements are mounted on the same surface of the substrate, then the layout is simplified, but isolation between transmission and reception circuit elements deteriorates

Engineering Contradiction:
Improvelayout complexityVSAvoidisolation between circuit elements
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent divides the substrate into functional regions, with the ground terminal creating a spatial separation zone between transmission and reception circuit elements. This segmentation of the layout space maintains electrical isolation while keeping all elements on the same substrate surface for manufacturing simplicity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The ground terminal acts as an intermediary barrier in the layout, positioned between transmission and reception circuit elements on the same substrate surface. This intermediate element provides the necessary isolation without requiring complex three-dimensional stacking or separate layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12074619B2Radio frequency module and communication device
Publication Date: 2024.08.27 MURATA MFG CO LTD
  • US12074619B2 patent drawing
  • US12074619B2 patent drawing
  • US12074619B2 patent drawing

AI summary

Improved is the isolation in a case in which a circuit element provided in a signal path for a transmission signal and a circuit element provided in a signal path for a reception signal are mounted on the same main surface of a mounting substrate. A radio frequency module includes the mounting substrate, a first, a second, and a third circuit elements, and a plurality of external connection terminals. The second circuit element and the third circuit element are mounted on a second main surface of the mounting substrate and are provided in signal paths for transmission and reception signals. The plurality of external connection terminals is arranged on the second main surface of the mounting substrate. The plurality of external connection terminals includes a ground terminal positioned between the second circuit element and the third circuit element in a plan view from a thickness direction of the mounting substrate.