Antenna-Integrated RF Module Grounding for Millimeter Wave
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Solution Overview
Problem
Miniaturization of RF modules for millimeter wave communications leads to deterioration in radiation characteristics and signal transmission efficiency due to high frequency RF signals, particularly in 5th generation communications.
Innovation Solution
An antenna-integrated RF module design featuring a multilayer substrate with patch antennas, ground members, and signal vias, where the ground members' penetration regions are strategically sized relative to the patch antennas to enhance radiation characteristics and reduce interference, maintaining efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the RF module is miniaturized, then the size of the module is reduced, but the radiation characteristics and signal transmission efficiency deteriorate
Solution Approach 1:
The patent transitions from a planar ground structure to a three-dimensional ground member that extends vertically between the antenna and signal via. This dimensional change allows the ground structure to provide improved radiation characteristics and signal shielding without increasing the horizontal footprint of the module, thus maintaining miniaturization while resolving the deterioration in radiation characteristics.
Solution Approach 2:
The ground member is nested within the vertical space between the antenna layer and the substrate layer, utilizing the existing three-dimensional space within the module. This nesting approach allows the ground structure to be integrated without adding external dimensions, maintaining compact size while improving radiation characteristics through the presence of the ground member.
2Volume of moving object
If the RF module is miniaturized, then the size of the module is reduced, but the signal transmission efficiency deteriorates
Solution Approach 1:
The ground member acts as an intermediary structure between the antenna and the signal via, providing electromagnetic shielding and reducing interference. This intermediary ground structure improves signal transmission efficiency by minimizing signal loss and interference, while its vertical orientation allows it to fit within the miniaturized module footprint.
3Reliability
If the penetration regions of ground members are enlarged, then the radiation characteristics improve, but the available space for other components is reduced
Solution Approach 1:
The ground member extends in the vertical dimension rather than expanding horizontally. By utilizing the z-axis space between the antenna and substrate layers, the ground structure achieves improved radiation characteristics through adequate penetration regions without consuming additional planar area, thus preserving space for other components in the miniaturized module.
Data Source
AI summary
An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.