RF Module Heat Dissipator Legs for Power Amplifier Thermal Management
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Solution Overview
Problem
The semiconductor module disclosed in Japanese Unexamined Patent Application Publication No. 2011-40602 has insufficient heat dissipation of the power amplifier in mobile communication devices.
Innovation Solution
A radio frequency module with a substrate having a power amplifier on its lower surface and a heat dissipator that includes a heat dissipation plate covering the power amplifier's opposite surface and leg extensions towards the substrate's principal surface, enhancing heat dissipation by conveying heat to a mother board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the power amplifier is disposed on the lower surface of the substrate, then the space utilization is improved, but the heat dissipation becomes insufficient
Solution Approach 1:
The heat dissipator extends in the vertical dimension with legs reaching toward the substrate's principal surface, transforming a two-dimensional heat dissipation problem into a three-dimensional solution. This allows heat to be dissipated through multiple spatial dimensions rather than being constrained to the lower surface plane.
Solution Approach 2:
The heat dissipator acts as an intermediary component between the power amplifier and the substrate's principal surface. It conducts heat from the power amplifier and transfers it to the substrate structure, serving as a thermal bridge that resolves the heat dissipation limitation of the lower surface mounting configuration.
2Temperature
If the heat dissipator includes legs extending toward the substrate, then the heat dissipation is improved, but the device complexity increases
Solution Approach 1:
The heat dissipator combines multiple functions into a single component: it provides thermal conduction from the power amplifier, structural support for the power amplifier mounting, and electrical connection pathways through its legs. This merging reduces the need for separate components and simplifies the overall device structure despite the enhanced heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation of the power amplifier, preventing heat-related degradation and noise interference, while allowing for downsizing and effective use of module space.
Implementation Method 1
a heat dissipator that dissipates heat of the power amplifier
Data Source
AI summary
A radio frequency module includes: a module substrate that includes a principal surface on which external-connection terminals are disposed; a power amplifier that is disposed on the principal surface of the module substrate and amplifies a radio frequency transmission signal; and a heat dissipator that dissipates heat of the power amplifier. The heat dissipator includes: a heat dissipation plate that covers a surface of the power amplifier which is opposite to a surface that faces the module substrate; and at least a first leg that extends from the heat dissipation portion toward the principal surface of the module substrate.