RF Module Heat Dissipation Electrode for Compact Power Amplifiers
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Solution Overview
Problem
The existing radio-frequency modules face challenges in heat dissipation due to elongated heat dissipation paths, which degrade their thermal resistance and overall heat dissipation capability, particularly in mobile communication devices with multiband communication capabilities.
Innovation Solution
A radio-frequency module design featuring a mounting board with components on both surfaces, where the power amplifier is mounted on one surface and coupled to a heat dissipation electrode through a bonding wire or through-substrate via, reducing thermal resistance by bypassing planar wiring patterns and enhancing heat dissipation by utilizing external substrates for heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the power amplifier is mounted on the back surface of the wiring board and grounded via the wiring board, then the semiconductor module can be downsized, but the heat dissipation path becomes elongated and thermal resistance increases
Solution Approach 1:
The invention transitions the heat dissipation path from a planar two-dimensional route through the wiring board to a three-dimensional vertical path using a through-via that extends from the front surface through the wiring board to the back surface. This dimensional change allows heat to be conducted directly from the power amplifier through the via to the heat dissipation electrode, significantly shortening the thermal path while maintaining the compact module structure.
2Device complexity
If the ground path extends through a planar wiring pattern along the mounting surface, then the circuit layout is simplified, but the heat dissipation path becomes relatively long
Solution Approach 1:
The invention introduces a vertical through-via structure that creates a three-dimensional heat dissipation path perpendicular to the mounting surface. This eliminates the need for heat to travel laterally through planar wiring patterns, directly connecting the power amplifier's heat-generating elements to the heat dissipation electrode through the thickness of the wiring board, thereby dramatically reducing path length.
Solution Approach 2:
The through-via acts as an intermediary thermal conduction path between the power amplifier mounted on the front surface and the heat dissipation electrode on the back surface. This intermediary structure provides a dedicated, low-thermal-resistance pathway that bypasses the less efficient planar wiring patterns, enabling effective heat transfer across the wiring board thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the heat dissipation capability of the power amplifier, enabling smaller and more efficient radio-frequency modules and communication devices by reducing thermal resistance and increasing heat transfer efficiency.
Implementation Method 1
a first bonding wire coupled to the fourth major surface, and a heat dissipation electrode disposed apart from the power amplifier on a fourth major surface side with respect to the power amplifier and coupled to the first bonding wire
Implementation Method 2
a heat dissipation electrode disposed apart from the power amplifier on a fourth major surface side with respect to the power amplifier and coupled to the first bonding wire
Data Source
AI summary
A radio-frequency module (1) includes a module substrate (70) having major surfaces (701 and 702) opposite to each other, external connection terminals (90a and 90b) disposed on the major surface (702), a power amplifier (11) having major surfaces (111 and 112) opposite to each other and being disposed on the major surface (702) such that the major surface (111) is a mounting surface on the module substrate (70), a bonding wire (45) coupled to the major surface (112), and a heat dissipation electrode (91) disposed apart from the power amplifier (11) on the major surface (112) side with respect to the power amplifier (11) and coupled to the bonding wire (45).