RF Module Substrate Layout for Reduced Package Height
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Solution Overview
Problem
Existing radio-frequency modules have a high thickness due to the placement of components on both sides of the mounting substrate, making it challenging to reduce the overall height of the module while maintaining functionality.
Innovation Solution
The radio-frequency module design includes a mounting substrate with components mounted on one side, featuring a first and second chip component with substrates of the same material, where at least part of the second substrate surface is exposed, allowing for a uniform thickness reduction by aligning bonding regions and using resin layers to cover components, thereby reducing the overall module height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If components are mounted on both sides of the mounting substrate to reduce the substrate area, then the component density increases, but the overall height of the radio-frequency module increases
Solution Approach 1:
The patent transitions from a two-dimensional layout (components on one side) to a three-dimensional stacked architecture (components on both sides at different heights). By utilizing the thickness dimension of the substrate and stacking chip components vertically, the design achieves higher component density without significantly increasing the overall module height, as the stacked arrangement efficiently uses the available vertical space.
Solution Approach 2:
The patent implements a nested structure where chip components are mounted on both the front and back sides of the mounting substrate, with some components positioned at different height levels. This nested arrangement allows multiple components to occupy overlapping projected areas, effectively reducing the required substrate area while maintaining a compact overall height through vertical integration.
2Length of stationary object
If the thickness of the mounting substrate is reduced to decrease module height, then the module becomes more compact, but the structural strength and component mounting capability deteriorate
Solution Approach 1:
The patent employs a composite structure combining the mounting substrate with multiple chip components, resin layers, and protective coatings. This composite architecture provides enhanced mechanical strength and structural integrity despite the reduced substrate thickness, as the combined assembly of multiple layers and components distributes mechanical loads and prevents substrate deformation.
Solution Approach 2:
The patent incorporates resin layers and protective structures before final assembly to cushion and protect the thin substrate from mechanical damage. These pre-applied protective layers absorb mechanical stresses and prevent substrate breakage during handling and operation, enabling the use of thinner substrates without compromising overall structural reliability.
3Length of stationary object
If chip components are mounted with their second main substrate surface exposed to reduce height, then the module height decreases, but the manufacturing precision requirements increase
Solution Approach 1:
The patent performs preliminary positioning and alignment of chip components during the mounting process, ensuring that the second main substrate surfaces are properly oriented and positioned before final bonding. This preliminary action includes precise placement of components on the substrate and alignment of bonding pads, which simplifies subsequent processing steps and reduces the need for high-precision operations at later stages.
Solution Approach 2:
The patent uses resin layers and bonding materials as intermediaries between the chip components and the mounting substrate. These intermediary materials provide tolerance for manufacturing variations and facilitate alignment, allowing components to be mounted with relaxed precision requirements while still achieving the desired exposed surface configuration for height reduction.
Data Source
AI summary
To reduce the height in a thickness direction of a mounting substrate. A radio-frequency module includes a mounting substrate, an electronic component, first and second chip components. The electronic component is mounted on a first main surface of the mounting substrate. The first and second chip components are mounted on a second main surface of the mounting substrate. Each of the first and second chip components includes a substrate and a circuit portion. The substrate has first and second main surfaces facing each other. The circuit portion is formed on the first main surface side of the substrate. The second main surface of the substrate in each of the first and second chip components is exposed. A material of the substrate in the first chip component is the same as a material of the substrate in the second chip component.