Radio-Frequency Module Height Reduction via IC Chip Integration
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Solution Overview
Problem
Conventional radio-frequency modules face limitations in reducing height, leading to increased size and potential transmission losses due to the need for additional resin-based substrates for mounting components.
Innovation Solution
The configuration includes an IC chip with a semiconductor core substrate and a metal wiring layer, allowing mounted components to be directly attached to the IC chip, eliminating the need for separate resin-based substrates, and incorporating a rewiring layer for improved flexibility and reduced parasitic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If mounted components are attached to a resin-based substrate, then components can be mounted, but the height of the radio-frequency module increases
Solution Approach 1:
The patent merges the IC chip and the mounted component mounting base into a single integrated structure. The IC chip itself serves as the mounting substrate, eliminating the need for a separate resin-based substrate. This integration directly reduces the overall height of the radio-frequency module while maintaining the functionality of component mounting.
Solution Approach 2:
The patent extracts and eliminates the unnecessary resin-based substrate from the conventional structure. By removing this intermediate layer and directly mounting components onto the IC chip, the design simplifies the structure and reduces height without compromising mounting capability.
2Reliability
If additional resin-based substrates are used for mounting, then components can be mounted, but transmission losses increase
Solution Approach 1:
By combining the IC chip and mounting base functions into one unit, the patent eliminates additional resin-based substrates that would introduce transmission losses. The direct integration reduces the number of interfaces and material layers through which RF signals must pass, thereby improving transmission characteristics and reducing energy loss.
3Length of moving object
If mounted components are directly attached to the IC chip, then height is reduced, but arrangement flexibility may be limited
Solution Approach 1:
The patent utilizes the top surface of the IC chip as the mounting substrate, effectively using the available dimensional space. By mounting components on the upper surface of the IC chip rather than requiring a separate lateral substrate, the design achieves height reduction while maintaining arrangement flexibility through proper positioning on the chip surface.
Data Source
AI summary
A radio-frequency module (10) includes an IC chip (20) and a mounted component (41, 42, 43) mounted on the IC chip (20). The IC chip (20) includes a core substrate (21) composed of a semiconductor having a first main surface (211) and a second main surface (212) opposed to each other, and a metal wiring layer (22) formed on the first main surface (211) of the core substrate (21) and having a contact surface in contact with the first main surface (211) and a third main surface (221) opposed to the contact surface. The mounted component (41, 42, 43) is mounted at the third main surface (221) side.