5G RF Module Inductor Layout for Lower Magnetic Coupling
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Solution Overview
Problem
Magnetic field coupling between inductors and other circuit components in radio-frequency modules with multiple transfer paths degrades the transfer characteristic.
Innovation Solution
A radio-frequency module design with hybrid filters and inductors positioned on opposite major surfaces of a substrate, where the distance between certain inductors is strategically increased to reduce magnetic field coupling, including a configuration with wider pass bands and impedance matching inductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple inductors are placed close together in a radio-frequency module with multiple transfer paths, then the device complexity is reduced and integration is improved, but magnetic field coupling occurs between inductors causing degradation of transfer characteristic
Solution Approach 1:
The patent applies dimensionality change by moving inductors from a two-dimensional planar arrangement to a three-dimensional vertical arrangement on opposite surfaces of a substrate. Specifically, first inductors are disposed on a first major surface while second inductors are disposed on a second major surface opposite to the first major surface. This spatial separation in the vertical dimension reduces magnetic field coupling between inductors while maintaining integration, thereby resolving the contradiction between device complexity and transfer characteristic reliability.
2Area of stationary object
If inductors are positioned close together for compact design, then the area occupied by the radio-frequency module is reduced, but magnetic field coupling degrades the transfer characteristic
Solution Approach 1:
The patent utilizes the vertical dimension by placing inductors on opposite major surfaces of a substrate rather than spreading them out in the horizontal plane. This allows the radio-frequency module to maintain a compact footprint while achieving sufficient spatial separation between inductors to minimize magnetic field coupling, thus resolving the contradiction between compact area and transfer characteristic reliability.
3Reliability
If the distance between inductors is increased to reduce magnetic field coupling, then the transfer characteristic is improved, but the area occupied by the radio-frequency module increases
Solution Approach 1:
The patent resolves this contradiction by exploiting the vertical dimension through substrate thickness. First inductors are positioned on the first major surface and second inductors on the second major surface, separated by the substrate thickness rather than requiring large horizontal distances. This achieves effective magnetic field isolation and improved transfer characteristic while maintaining a compact overall area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Suppresses degradation of transfer characteristics by minimizing magnetic field coupling, enhancing signal quality in frequently used communication bands.
Implementation Method 1
the inductors of the hybrid acoustic LC filters and other circuit components in the radio-frequency module can be coupled to each other via magnetic fields, resulting in degradation of the transfer characteristic of the radio-frequency module
Data Source
AI summary
A radio-frequency module includes a module substrate, a hybrid filter for 5th Generation New Radio (5G-NR) n77 including a first acoustic wave resonator element, a first inductor, and a first capacitor, a filter for 5G-NR n79 including a second acoustic wave resonator element and a second inductor, power amplifiers, a third inductor coupled between the power amplifier and the hybrid filter, and a fourth inductor coupled between the power amplifier and the filter. The first inductor, the second inductor, the third inductor, and the fourth inductor are disposed at a major surface or inside the module substrate. The distance between the first inductor and the third inductor is larger than the distance between the second inductor and the fourth inductor.