RF Module Substrate Inductor Overlap Parasitic Capacitance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In RF modules, parasitic capacitance between wires can degrade the characteristics of amplifier circuits, particularly in designs with integrated circuit devices and inductor components, leading to impaired signal processing and noise factor characteristics.
Innovation Solution
The RF module design optimizes wire connections by using the shortest lengths between terminals, incorporates a chip inductor as a matching circuit unit for impedance matching, and employs shield films and resin sealing to minimize parasitic capacitance and magnetic flux interference, while arranging inductors with parallel coil axes to reduce magnetic field coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire connections are made between the integrated circuit device and the inductor device, then electrical connectivity is achieved, but parasitic capacitance is generated between the wire and other wiring lines
Solution Approach 1:
The patent extracts the harmful wire connections from the conventional design by eliminating the need for external wires between the inductor device and integrated circuit device. The inductor device is directly mounted on the substrate with its terminals electrically connected to the substrate's conductive patterns, removing the source of parasitic capacitance generated by wire-to-wire coupling.
Solution Approach 2:
The substrate acts as an intermediary between the inductor device and the integrated circuit device. Instead of direct wire connections, electrical connectivity is achieved through the substrate's conductive patterns and terminal structures, which mediate the signal transmission while minimizing parasitic effects.
2Productivity
If higher-density integration is achieved for switch circuit component and amplifier circuit component, then component density is improved, but wiring complexity increases
Solution Approach 1:
The patent merges the inductor device with the substrate structure, integrating the inductor's terminal structures directly into the substrate's conductive pattern system. This consolidation eliminates the need for separate wire connections and reduces wiring complexity while maintaining high component density.
Solution Approach 2:
The patent transitions from three-dimensional wire connections to two-dimensional planar conductive patterns on the substrate. By utilizing the substrate's surface area for electrical connections instead of vertical wire routing, the design achieves higher density integration with simplified connectivity.
Data Source
AI summary
A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.