High-Frequency Module Layout for Lower Insertion Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing high-frequency modules experience increased insertion loss due to wiring patterns connecting duplexers and single filters, leading to deteriorated transmission characteristics, particularly in communication terminals that need to support multiple communication bands.
Innovation Solution
A high-frequency module configuration with a switch, a multiplexer, and a single filter, where the electrical distance between the multiplexer and the switch is shorter than between the single filter and the switch, reducing insertion loss and improving transmission characteristics by optimizing signal transmission paths and impedance matching across various communication bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a multiplexer and single filter are connected to a switch element with equal transmission path lengths, then the module structure is simple and easy to manufacture, but insertion loss increases and transmission characteristics deteriorate
Solution Approach 1:
The patent applies local quality by making the transmission path from the switch element to the multiplexer shorter than the transmission path to the single filter. This asymmetric configuration optimizes signal quality locally at the multiplexer connection point, reducing insertion loss for the filter combination path while accepting a longer path for the single filter path.
2Reliability
If the transmission path to the multiplexer is made shorter, then insertion loss is reduced and transmission characteristics improve, but the overall module layout becomes more complex
Solution Approach 1:
The patent utilizes spatial arrangement in multiple dimensions on the substrate, positioning the multiplexer closer to the switch element in the planar layout. This dimensional optimization allows the shorter transmission path to be achieved without significantly increasing the overall module footprint, maintaining ease of manufacture while improving transmission characteristics.
Data Source
AI summary
A high-frequency module includes a high-frequency switch, filters (21 to 23), (31 to 33), and connection circuits (41 to 46). The high-frequency switch has filter-side terminals (Ps1 to Ps 6). The filters (21, 22, 23) each include a plurality of filters having characteristics different from each other. The filters (31, 32, 33) each include one type of filter. The connection circuits (41, 42, 43) connect the terminals (Ps1, Ps2, Ps3) of the high-frequency switch to the common terminals (Pc21, Pc22, Pc23) of the filters (21, 22, 23), respectively. The connection circuits (44, 45, 46) connect the terminals (Ps4, Ps5, Ps6) of the high-frequency switch to the filters (31, 32, 33), respectively. The connection circuits (41, 42, 43) are shorter than the connection circuits (44, 45, 46).