3D High-Frequency Module Layout for Size and Isolation
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Solution Overview
Problem
High-frequency modules in mobile communication devices face challenges in reducing size while maintaining adequate isolation between electronic components, leading to potential interference and signal quality issues.
Innovation Solution
A high-frequency module configuration with multiple electronic components, including filters and amplifiers, strategically disposed between and on module substrates, along with external connection terminals, to enhance isolation and reduce size by distributing components in three layers: between, on, and within the substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the high-frequency module is reduced by using two module substrates, then the module size decreases, but the isolation between electronic components deteriorates
Solution Approach 1:
The patent transitions from planar component arrangement to three-dimensional spatial distribution by placing electronic components on both the first and second module substrates, as well as within the substrate layers. This multi-layer configuration reduces the planar footprint while maintaining adequate isolation distances through vertical separation, effectively resolving the contradiction between miniaturization and component isolation.
Solution Approach 2:
The patent divides the electronic components into multiple groups distributed across different substrates and layers. Specifically, components are segmented between the first module substrate (with first electronic components), the second module substrate (with second electronic components), and within the substrate structures. This segmentation allows each component group to maintain sufficient isolation while contributing to overall module size reduction.
2Volume of moving object
If electronic components are densely packed to reduce module size, then the module size decreases, but signal interference increases
Solution Approach 1:
By utilizing three-dimensional space across multiple substrates and layers, the patent achieves dense packing without planar overcrowding. The vertical arrangement on different substrates and within substrate layers provides natural signal isolation paths, reducing electromagnetic interference while maintaining compact overall dimensions.
Solution Approach 2:
The patent introduces the module substrate structure as an intermediary element that physically separates and electrically isolates different electronic components. The substrate acts as a mediator that enables dense component integration while providing grounding paths, shielding, and signal routing that prevent interference between closely packed components.
Data Source
AI summary
A high-frequency module includes a module substrate having major surfaces, and a module substrate having major surfaces. The major surface are disposed facing the major surface. A first electronic component includes a filter coupled to a power amplifier and a low-noise amplifier. A second electronic component includes a filter coupled to a low-noise amplifier. A third electronic component includes a switch coupled between filters and an antenna connection terminal. The first electronic component is disposed between the major surfaces, on the major surface, or on the major surface. The second electronic component is disposed between the major surfaces, on the major surface, or on the major surface where the first electronic component is not disposed. The third electronic component is disposed between the major surfaces, on the major surface, or on the major surface wherein neither of the first nor second electronic component is disposed.