RF Module Isolation via Vertical Stacking and Segmentation

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Solution Overview

Problem

Conventional communication apparatuses experience reduced isolation when transmitting signals in different frequency bands simultaneously using a single radio-frequency module.

Innovation Solution

A radio-frequency module with a mounting substrate, power amplifiers, and output matching circuits arranged in a specific configuration to suppress isolation, where the power amplifiers and output matching circuits are aligned and positioned to ensure distinct signal output directions for different frequency bands.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple power amplifiers and output matching circuits are integrated in a single radio-frequency module, then device integration is improved, but isolation between different frequency bands deteriorates

Engineering Contradiction:

Improveintegration densityVSAvoidisolation

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from planar arrangement to three-dimensional stacking, placing power amplifiers and output matching circuits on different layers of the mounting substrate. This vertical dimensionality change allows signals at different frequencies to be isolated in the vertical direction while maintaining horizontal integration, effectively resolving the contradiction between integration density and isolation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent segments the radio-frequency module into distinct functional layers: power amplifiers are mounted on a first surface while output matching circuits are mounted on a opposite surface or different layer. This segmentation separates the signal paths for different frequency bands, reducing interference while maintaining compact integration.

Inventive Principle:

Principle #1Segmentation

2Area of stationary object

If power amplifiers and output matching circuits are arranged in a compact layout, then manufacturing area is reduced, but signal isolation deteriorates

Engineering Contradiction:

Improvemounting areaVSAvoidsignal isolation

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

By utilizing the vertical dimension through multi-layer mounting substrate configuration, the patent achieves compact horizontal footprint while maintaining adequate vertical separation between components. This allows compact layout without compromising signal isolation between different frequency bands.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11791853B2Radio-frequency module and communication apparatus

Publication Date: 2023.10.17 MURATA MFG CO LTD

AI summary

A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.