RF Module Land Impedance Matching via Coupling Part
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Solution Overview
Problem
Existing radio-frequency modules using BGA packages face challenges in achieving impedance matching without increasing circuit scale, particularly in millimeter wave bands, due to impedance discontinuities caused by capacitance effects in land structures.
Innovation Solution
Incorporating a coupling part that partially short-circuits the land and ground conductor, allowing for impedance matching by adjusting the configuration of the land, isolation part, and coupling part based on frequency, thereby reducing signal reflection and enhancing pass characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a matching circuit is provided in part of the signal line to achieve impedance matching, then impedance matching is improved, but the circuit scale increases
Solution Approach 1:
The patent extracts the impedance matching function from a separate matching circuit and integrates it into the land structure itself. By removing the need for additional matching circuits and incorporating the matching function directly into the existing land geometry, the solution achieves impedance matching without increasing circuit scale.
Solution Approach 2:
The patent merges the impedance matching function with the land structure by combining multiple lands into a composite land configuration. This integration allows the land structure to simultaneously serve as both the electrical connection element and the impedance matching element, eliminating the need for separate matching circuits.
2Productivity
If the land structure is modified to achieve impedance matching, then signal transmission efficiency is improved, but the design complexity increases
Solution Approach 1:
The patent applies local quality by creating a composite land structure where different portions of the land have different properties. The first land and second land are positioned at different locations relative to the via, creating localized impedance variations that collectively achieve impedance matching. This allows impedance control through local geometric modifications rather than complex overall redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively achieves impedance matching and improves signal transmission efficiency in millimeter wave bands by reducing impedance discontinuity and increasing signal intensity, while maintaining a simple circuit design.
Implementation Method 1
In order to improve pass characteristics of a signal, it is necessary to match impedance. This configuration effectively achieves impedance matching and improves signal transmission efficiency in millimeter wave bands by reducing impedance discontinuity
Implementation Method 2
allowing for impedance matching by adjusting the configuration of the land, isolation part, and coupling part based on frequency, thereby reducing signal reflection and enhancing pass characteristics
Data Source
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AI summary
A radio-frequency module includes: boards; interconnect parts that are conductor layers on the individual boards, at least one of the conductor layers being connected to an RF chip; a land that is a conductor layer connected to one of the interconnect parts; a transmission unit disposed between the boards, connected to the boards through the land to transmit a signal; a ground conductor disposed around the land and the interconnect part connected to the land; an isolation part disposed between the interconnect layer connected to the land and the ground conductor to isolate the interconnect layer connected to the land from the ground conductor; and a coupling part disposed between the land and the ground conductor to short-circuit the land and the ground conductor.