RF Module Layered Structure for Signal Loss and Warpage
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Solution Overview
Problem
Current radio frequency modules face challenges in efficiently transmitting high-frequency RF signals while minimizing transmission loss and preventing warpage of layers, especially in supporting the increasing data traffic demands of 5G and mmWave communications.
Innovation Solution
The radio frequency module incorporates a RFIC with a wiring via and feed line configuration, including multiple ground layers and insulating layers with varying dielectric constants, along with patch antenna patterns and insulating adhesive layers, to reduce transmission loss and prevent warpage by optimizing the dielectric constants and layer distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple insulating layers with different dielectric constants are used to reduce transmission loss, then RF signal transmission quality is improved, but layer structure complexity increases
Solution Approach 1:
The patent applies local quality by using different dielectric constant values for different insulating layers. Specifically, the first insulating layer has a dielectric constant of 3.0-4.0 while the second insulating layer has a dielectric constant of 2.0-3.0. This localized differentiation optimizes signal transmission in different regions of the module, reducing overall transmission loss while maintaining manageable structural complexity through purposeful material selection.
2Object-affected harmful factors
If multiple ground layers are added to shield RF signals, then electromagnetic interference is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the grounding function into multiple distinct ground layers (first ground layer and second ground layer) separated by insulating layers. Each ground layer serves specific shielding purposes for different signal paths - the first ground layer shields the base signal line while the second ground layer shields the RF signal line. This segmentation approach effectively reduces electromagnetic interference through targeted shielding while maintaining manufacturing feasibility by using standard layered PCB construction techniques.
3Reliability
If insulating layers with high dielectric constant are used to reduce transmission loss, then signal integrity is improved, but warpage resistance decreases
Solution Approach 1:
The patent applies parameter changes by carefully selecting and controlling the dielectric constant values of different insulating layers. The first insulating layer uses a higher dielectric constant (3.0-4.0) to reduce transmission loss, while the second insulating layer uses a lower dielectric constant (2.0-3.0) to balance structural stability. This parameter optimization approach maintains signal integrity where needed while preventing excessive warpage through balanced material selection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces transmission loss, enhances RFIC performance, and minimizes the likelihood of warpage, enabling efficient high-frequency signal transmission and compact module design suitable for 5G and mmWave communications.
Implementation Method 1
a dielectric constant of the at least one IC insulating layer is higher than a dielectric constant of the feed-line insulating layer
Data Source
AI summary
A radio frequency module includes a radio frequency integrated circuit (RFIC) to input or output a base signal and a radio frequency (RF) signal having a higher frequency than the base signal, a wiring via extending upward from the RFIC and a feed line electrically connected to the wiring via to provide a transmission path of the RF signal, a second ground layer surrounding the feed line, a first ground layer spaced above the second ground layer, a third ground layer between the second ground layer and the RFIC, a feed-line insulating layer disposed between the first and third ground layers, an IC wiring layer between the third ground layer and the RFIC, electrically connected to the RFIC, and providing a transmission path of the base signal, and an IC insulating layer between the third ground layer and the RFIC, having a higher dielectric constant than the feed-line insulating layer.