RF Module Layout With Fewer Inter-Substrate Connections

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Solution Overview

Problem

The complexity of radio-frequency modules in mobile communication devices is increased by the number of inter-substrate connection terminals required for coupling two module substrates, making it difficult to reduce the size of the module.

Innovation Solution

A radio-frequency module configuration with a first and second module substrate, where electronic components including switches and filters are disposed between and on the substrates, reducing the need for inter-substrate connection terminals by integrating them within the module structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are disposed on two separate module substrates, then the radio-frequency module can support multiple bands, but the number of inter-substrate connection terminals increases

Engineering Contradiction:

Improveband support capabilityVSAvoidnumber of inter-substrate connection terminals

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent consolidates multiple electronic components (first electronic component with first switch, second electronic component with first filter, third electronic component with second filter) onto a single module substrate. This merging approach reduces the number of inter-substrate connection terminals needed while maintaining the capability to support multiple communication bands through the integrated switch and filter network.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The first switch is configured to selectively connect the input terminal to different filters (first filter, second filter) based on the required communication band. This multi-functional switch allows a single substrate to handle multiple bands by dynamically routing signals through appropriate filters, eliminating the need for separate substrates for each band.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Volume of moving object

If the number of inter-substrate connection terminals is reduced, then the module size can be reduced, but the trace length and trace loss may increase

Engineering Contradiction:

Improvemodule sizeVSAvoidtrace loss

Core Design Contradiction:

Volume of moving objectVSLoss of energy

Solution Approach 1:

By merging all electronic components onto a single module substrate, the patent eliminates the need for inter-substrate connections, thereby reducing the overall module size. The integrated layout optimizes trace routing between components, keeping trace lengths short and minimizing trace loss despite the consolidated structure.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20240030957A1Radio-frequency module and communication device

Publication Date: 2024.01.25 MURATA MFG CO LTD

AI summary

A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a plurality of external connection terminals disposed on the major surface; a plurality of inter-substrate connection terminals disposed between the major surfaces to couple the module substrate to the module substrate; a first electronic component (integrated circuit) including a switch; a second electronic component including a filter coupled to a power amplifier via the switch; and a third electronic component including a filter coupled to the power amplifier via the switch. The first electronic component, the second electronic component, and the third electronic component are disposed in the same module substrate.