RF Module LNA Layout for Compact Multiband Reception
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional radio frequency modules are large and complex, necessitating further downsizing to accommodate multiband communications in mobile devices.
Innovation Solution
The radio frequency module design includes dual low-noise amplifiers with distinct amplification elements and matching circuits disposed on opposite surfaces of a module substrate, reducing footprint and wiring length, and eliminating the need for switches between amplifiers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If circuit components are packaged in a conventional radio frequency module, then the module can perform multiband communications, but the module size becomes large
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of components to a three-dimensional stacked configuration. The first and second low-noise amplifiers are positioned on opposite surfaces of the module substrate, with their respective matching circuits also distributed across different surfaces. This vertical stacking approach充分利用 the three-dimensional space, significantly reducing the horizontal footprint of the radio frequency module while accommodating multiple components necessary for multiband communications.
Solution Approach 2:
The module substrate serves multiple functions simultaneously: it provides mechanical support for mounting components, acts as a signal transmission medium through its conductive patterns, and enables spatial separation of components by its dual-surface structure. The substrate integrates structural, electrical, and organizational functions, reducing the need for additional supporting structures and thereby minimizing overall module size.
2Device complexity
If multiple amplifiers and matching circuits are disposed on the same surface, then wiring is simplified, but the module area increases
Solution Approach 1:
The patent utilizes the third dimension (vertical direction) to resolve the conflict between wiring simplicity and area minimization. By placing the first low-noise amplifier and its matching circuit on one surface while positioning the second low-noise amplifier and its matching circuit on the opposite surface, the design reduces the horizontal distance between related components. The module substrate's thickness becomes the connecting dimension, allowing compact routing of inter-component signals through vias and internal conductors.
3Length of stationary object
If amplification elements and matching circuits are disposed close to each other, then wiring length is reduced, but mismatching losses increase
Solution Approach 1:
The patent employs vertical separation to simultaneously achieve short wiring length and proper impedance matching. By positioning each amplification element and its corresponding matching circuit on the same surface of the module substrate, the horizontal wiring length is minimized. The close proximity in the planar view ensures strong electrical coupling and reduced parasitic effects, while the vertical stacking maintains compact overall dimensions.
Data Source
AI summary
A radio frequency module includes: a first low-noise amplifier including a first amplification element as an input stage and a second amplification element as an output stage; a second low-noise amplifier including a third amplification element as an input stage and the second amplification element as an output stage, the third amplification element being different from the first amplification element; a first matching circuit connected to an input terminal of the first low-noise amplifier; and a module substrate including a first principal surface and a second principal surface opposite to each other, wherein the first amplification element is disposed on one of the first principal surface and the second principal surface, and the first matching circuit is disposed on the other of the first principal surface and the second principal surface.