RF Module Shield Structure With Mesh Sheet Resin Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The adhesion between the sealing resin layer and the conductive shield in radio frequency modules is degraded due to shedding of inorganic filler particles, which affects the shield effect and reliability of the module.
Innovation Solution
A radio frequency module design that includes a mesh sheet on the opposite surface of the sealing resin layer, with portions embedded in the resin layer, enhancing the bonding between the sealing resin layer and the shield film, and allowing for identification symbols or characters to be formed by laser processing without compromising the adhesion or damaging the electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If inorganic filler particles with various sizes are mixed in the sealing resin layer to achieve both strength and fluidity, then the resin properties are improved, but the inorganic filler is likely to shed from the resin material, degrading adhesion between the sealing resin layer and the conductive shield
Solution Approach 1:
A mesh sheet is introduced as an intermediary component between the sealing resin layer and the conductive shield. The mesh sheet has portions embedded in the sealing resin layer and portions extending outward, creating a mechanical interlocking structure that prevents filler particle shedding and maintains adhesion reliability.
Solution Approach 2:
The mesh sheet structure changes the mechanical parameters of the sealing resin layer by providing a reinforcing framework. This framework allows the resin to maintain both strength and fluidity characteristics while preventing the shedding of inorganic filler particles that would otherwise degrade adhesion.
2Reliability
If a mesh sheet is added to improve adhesion between sealing resin layer and shield film, then adhesion is stabilized, but device complexity increases
Solution Approach 1:
The mesh sheet is constructed from thin, flexible linear members that can be easily integrated into the existing module structure. This thin-film approach provides the necessary adhesion stabilization without significantly increasing device complexity or volume.
3Loss of information
If laser processing is used to form identification symbols on the mesh sheet, then identification capability is enabled, but there is risk of damaging electronic components underneath
Solution Approach 1:
The mesh sheet structure with its open mesh pattern segments the laser beam path, allowing controlled laser processing for identification marking while the mesh structure itself protects underlying electronic components from excessive energy concentration and potential damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the adhesion between the sealing resin layer and the shield film, improving the shield effect while enabling recognizable identification symbols or characters to be formed through laser processing without harming the electronic components.
Implementation Method 1
A portion of the mesh sheet is embedded in the sealing resin layer in a thickness direction of the mesh sheet
Implementation Method 2
an identification symbol or an identification character to be formed therein with a recess formed by laser processing
Data Source
AI summary
An adhesion between a sealing resin layer and a shield film is improved by a mesh sheet disposed on an opposite surface of the sealing resin layer. A radio frequency module includes a wiring board, a component mounted on an upper surface of the wiring board, a sealing resin layer that covers the component, a mesh sheet disposed on an upper surface of the sealing resin layer, and a shield film provided to cover the upper surface and side surfaces of the sealing resin layer, and the mesh sheet. The mesh sheet and the sealing resin layer, as well as the mesh sheet and the shield film are firmly in adhesion with one another. Thus, the adhesion between the sealing resin layer and the shield film can be improved.