Radio-Frequency Module Shielding With Bent Metal Pins
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Solution Overview
Problem
Existing radio-frequency modules with shield films have low design flexibility and unstable shielding characteristics due to the deformation of bonding wires, which can lead to damage and interference with high-density mounting.
Innovation Solution
A radio-frequency module design utilizing metal pins with extended portions arranged around components to form a shield member, providing improved design flexibility and stability, as the metal pins are less prone to deformation and allow for closer spacing without contact issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If bonding wires are used to form a shield member, then design flexibility is improved, but the shielding characteristics become unstable due to deformation
Solution Approach 1:
The patent changes the material parameter from soft bonding wires to rigid metal pins, fundamentally altering the mechanical properties of the shield member. This parameter change eliminates deformation issues while preserving design flexibility, as the metal pins can still be positioned anywhere around the component but maintain their shape and spacing during sealing resin formation.
2Productivity
If bonding wires are arranged close to the component, then high-density mounting is enabled, but the bonding wires may deform and contact the component causing damage
Solution Approach 1:
The patent changes the mechanical parameter of the shield member from flexible bonding wires to rigid metal pins. This allows the shield to be positioned very close to the component without risk of deformation-induced contact, enabling high-density mounting while ensuring component safety. The rigid structure of metal pins prevents the bending and deformation that occurs with bonding wires.
3Reliability
If a shield film coating the sealing resin layer surface is used, then shielding is provided, but design flexibility is reduced
Solution Approach 1:
The patent segments the shield into multiple individual metal pins that can be independently positioned around the component. Unlike a continuous shield film that covers the entire sealing resin surface, the metal pins can be selectively placed only where shielding is needed, providing both shielding function and design flexibility. This segmentation allows precise control over which components are shielded.
4Reliability
If distance is increased between bonding wires and component to prevent contact, then component damage is prevented, but high-density mounting is interfered with
Solution Approach 1:
The patent changes the rigidity parameter of the shield member from flexible bonding wires to rigid metal pins. This allows the shield to be positioned at minimal distance from the component without risk of contact during sealing, maximizing mounting density while maintaining component protection. The rigid structure eliminates the need for safety margins required with flexible bonding wires.
Data Source
AI summary
A radio-frequency module having high design flexibility of a shield with less likelihood of variation in shielding characteristics is provided. A radio-frequency module includes a multilayer circuit board, a component mounted on a top surface of the multilayer circuit board, and a plurality of metal pins having a bent shape such that both end portions can be connected to the top surface of the multilayer circuit board. Each of the plurality of metal pins is provided upright on the top surface of the multilayer circuit board in a state where both end portions are connected to the top surface of the multilayer circuit board, and is arranged near the component to make up a shield member.