RF Module Amplifier Layout for Compact MIMO and Diversity Signals
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Solution Overview
Problem
Existing radio-frequency modules face challenges in reducing size while maintaining effective processing of diversity and MIMO signals, as they require increased circuit complexity and larger form factors to accommodate multiple antennas and frequency bands.
Innovation Solution
A radio-frequency module design featuring a substrate with a first circuit for amplifying diversity signals and a second circuit for amplifying MIMO signals, where both amplifiers are integrated on a single component in the central portion of the substrate, allowing for reduced size and improved efficiency by integrating additional circuits and minimizing component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple separate amplifier components are used to process diversity and MIMO signals, then signal processing capability is improved, but device size and complexity increase
Solution Approach 1:
The patent combines multiple amplifier components (first amplifier for diversity signal and second amplifier for MIMO signal) into a single integrated component. This merging reduces the overall component count and device complexity while maintaining the capability to individually process both diversity and MIMO signals through separate amplification channels within the integrated component.
2Reliability
If circuit elements are arranged separately to maintain signal isolation, then signal interference is reduced, but mounting area increases
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional vertical arrangement by stacking circuit elements on multiple layers. The first and second amplifiers are arranged on different layers of the substrate, with connection portions extending vertically between layers. This vertical dimensionality allows compact mounting area while maintaining signal isolation through layer separation and shielding structures.
Solution Approach 2:
The patent employs a nested arrangement where connection portions are embedded within the substrate structure, and shielding elements are integrated between functional components. The first and second amplifiers are nested on different layers with connection paths routed through the substrate, creating a compact nested configuration that maintains isolation while minimizing mounting area.
3Volume of moving object
If amplifier components are integrated on a single component, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The integrated amplifier component is segmented into distinct functional regions: first amplifier region for diversity signal processing, second amplifier region for MIMO signal processing, and connection portions for inter-layer routing. This segmentation allows modular manufacturing processes where each region can be fabricated and tested independently before final integration, reducing overall manufacturing complexity despite the integrated structure.
Data Source
AI summary
A radio-frequency module includes a substrate, a first circuit arranged on the substrate and includes a first amplifier for amplifying a diversity signal, and a second circuit arranged on the substrate and includes a second amplifier for amplifying a MIMO signal. The first amplifier and the second amplifier are formed on a single component and are arranged in a central portion in a plan view of the substrate. The first circuit and the second circuit may include a first matching element connected to the first amplifier and a second matching element connected to the second amplifier, respectively. The first amplifier and the second amplifier may be arranged in the central portion on a first main surface of the substrate. The first matching element and the second matching element may be arranged in the central portion on a second main surface of the substrate.