RF Module Board Layout for Transmission Path Noise Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In mobile communication devices, the complexity of radio frequency front-end circuits leads to digital noise and power supply noise interfering with transmission paths, deteriorating the quality of radio frequency signals amplified by transmission power amplifiers.
Innovation Solution
A radio frequency module with a module board having distinct principal surfaces for circuit components, where the transmission power amplifier and switch are on one surface, and the control circuit on another, ensuring isolation between control signals and radio frequency transmission paths to prevent noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the control circuit and transmission power amplifier are integrated on the same module board without surface separation, then the device complexity is reduced and integration is improved, but digital noise and power supply noise from the control circuit flow into the transmission path and deteriorate the quality of radio frequency signals
Solution Approach 1:
The module board is divided into two distinct principal surfaces: the first principal surface accommodates the transmission power amplifier and switch, while the second principal surface houses the control circuit. This segmentation physically separates noise-generating components from sensitive transmission paths, eliminating noise interference while maintaining integration benefits.
Solution Approach 2:
Instead of separating components in the planar dimension (which would increase device footprint), the patent utilizes the vertical dimension by assigning components to opposite surfaces of the module board. This three-dimensional arrangement achieves noise isolation without increasing the device's planar area, effectively resolving the contradiction between integration and noise suppression.
2Length of stationary object
If the switch and transmission power amplifier are placed close together on the same surface, then the connection length is reduced and signal loss is minimized, but the control circuit proximity causes digital noise to couple into the transmission path
Solution Approach 1:
The transmission path components (switch and power amplifier) are segmented and placed on the first principal surface, isolated from the control circuit on the second principal surface. This maintains short connection lengths for signal integrity while preventing noise coupling through physical separation across the board thickness.
3Ease of manufacture
If all circuit components are arranged on a single surface to simplify manufacturing, then the ease of manufacture is improved, but noise isolation and signal quality are deteriorated
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement to three-dimensional spatial distribution by utilizing both surfaces of the module board. This approach maintains manufacturing simplicity (all components are still mounted on a single module board structure) while achieving noise isolation through vertical separation, thus resolving the contradiction between ease of manufacture and noise suppression.
Data Source
AI summary
A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides; a transmission input terminal; a transmission power amplifier that amplifies a transmission signal input from the transmission input terminal; a switch that switches between connecting and disconnecting the transmission input terminal and the transmission power amplifier, and a control circuit that controls the transmission power amplifier using digital control signals. The switch is disposed on the first principal surface, and the control circuit is disposed on the second principal surface.