RF Module Layout Using Opposite-Side Mounting to Simplify Wiring
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Solution Overview
Problem
Existing radio frequency modules have complex wiring between power amplifiers, switches, and transmission filters when these elements are mounted on a board, making the setup cumbersome.
Innovation Solution
The radio frequency module is designed with a specific layout on a mounting board where the power amplifier, output matching circuit, first switch, and transmission filters are disposed in an orthogonal direction, and the low-noise amplifier and second switch are placed on opposite surfaces, simplifying the wiring and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power amplifiers, switches, and transmission filters are disposed on a mounting board in a conventional layout, then the radio frequency module can perform signal transmission, but the wiring becomes complex and cumbersome
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional planar layout to a three-dimensional stacked layout. Power amplifiers, switches, and transmission filters are arranged in multiple layers along the vertical axis of the mounting board, with connections established through vias and conductive structures. This vertical stacking dramatically reduces wiring complexity by shortening signal paths and eliminating the need for extensive lateral interconnections required in conventional flat layouts.
Solution Approach 2:
The patent implements nesting by placing multiple functional components in a hierarchical stacked configuration. The power amplifiers are positioned on one surface, with switches and transmission filters arranged on opposite or adjacent surfaces, creating a nested three-dimensional structure. This nesting allows components to be closely integrated, with connection terminals positioned to minimize inter-component wiring, effectively reducing the overall wiring complexity of the radio frequency module.
2Area of stationary object
If components are closely integrated to reduce footprint, then the module size decreases, but interference between components increases
Solution Approach 1:
The patent uses vertical stacking to achieve close integration while maintaining isolation. By arranging power amplifiers, switches, and transmission filters in three-dimensional space along the vertical axis rather than spreading them out horizontally, the module footprint is significantly reduced. The vertical separation between components, combined with strategic placement on opposite surfaces of the mounting board, maintains adequate electromagnetic isolation despite the compact overall size.
Solution Approach 2:
The patent applies local quality by creating spatially differentiated zones within the compact module structure. Power amplifiers generating high power are positioned in specific regions, while sensitive transmission filters are placed in other regions, with the mounting board's internal structure and grounding schemes providing localized electromagnetic shielding. This spatial differentiation of component functions within the compact three-dimensional layout reduces mutual interference while maintaining small footprint.
Data Source
AI summary
A radio frequency module includes a mounting board, a power amplifier, a plurality of transmission filters, a first switch, an output matching circuit, a low-noise amplifier, and an external-connection terminal. The mounting board includes a first principal surface and a second principal surface on opposite sides of the mounting board. The first switch switches a connection between the power amplifier and the transmission filters. The output matching circuit is connected between the power amplifier and the first switch. The low-noise amplifier is disposed on the second principal surface of the mounting board. The external-connection terminal is disposed on the second principal surface of the mounting board. The power amplifier, the output matching circuit, the first switch, and the transmission filters are disposed on the mounting board in stated order in a direction that is orthogonal to a thickness direction of the mounting board.