RF Module Transformers on Opposite Substrate Surfaces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing radio frequency modules face challenges in reducing size while minimizing signal loss, as they often compromise on either size reduction or signal efficiency.
Innovation Solution
The proposed radio frequency module employs a Doherty-type power amplifier circuit and a differential-amplifier-type power amplifier circuit, with transformers strategically placed on opposite surfaces of the module substrate, along with filter circuits and matching networks, to achieve concurrent transmission of multiple channels and power classes, thereby reducing size and signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all transformers are disposed on the first main surface to simplify layout, then device complexity is reduced, but signal loss increases due to longer connection paths and interference
Solution Approach 1:
The patent utilizes the third dimension by disposing transformers on both the first main surface and the second main surface of the module substrate. This spatial distribution reduces the planar footprint and connection path lengths, thereby reducing signal loss while maintaining manageable device complexity through vertical arrangement.
2Loss of energy
If transformers are disposed on both main surfaces to reduce signal loss, then signal loss is reduced, but device complexity increases due to asymmetric configuration
Solution Approach 1:
The patent applies local quality by making the configuration asymmetric according to specific needs: the first transformer connected to the Doherty power amplifier is on the first main surface, while the second transformer connected to the differential power amplifier is on the second main surface. This localized optimization reduces signal loss for each amplifier type without requiring complete symmetry throughout the entire device.
3Volume of moving object
If the module size is reduced by compacting components, then volume is reduced, but signal loss increases due to crowded layout and interference
Solution Approach 1:
By distributing transformers across both main surfaces of the module substrate, the patent effectively utilizes the vertical dimension to reduce the planar footprint. This compacting in the horizontal plane while maintaining adequate spacing through vertical separation reduces overall module volume while preventing signal interference that would occur in a crowded single-surface layout.
Data Source
AI summary
A radio frequency module includes a module substrate having main surfaces that are opposite to each other, a plurality of external connection terminals that are disposed on the main surface, power amplifier circuits that are disposed on the main surface, a transformer that is connected to the power amplifier circuit and disposed on the main surface, and a transformer that is connected to the power amplifier circuit and disposed on the main surface. The power amplifier circuit is a Doherty-type power amplifier circuit, and the power amplifier circuit is a differential-amplifier-type power amplifier circuit.