RF Module Layout Using Opposite Surfaces for Accurate Detection
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Solution Overview
Problem
Existing radio-frequency modules face issues of increased size and decreased detection accuracy due to components being mounted on the same major surface, leading to signal interference and jump.
Innovation Solution
The radio-frequency module design includes a chip inductor mounted on one major surface of the mounting substrate and a directional coupler on the opposite surface, reducing the module's size while minimizing signal interference and maintaining detection accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple components are mounted adjacent to each other on the same major surface of the module substrate, then the module can be compact, but detection accuracy decreases due to signal interference and jump
Solution Approach 1:
The patent applies dimensionality change by mounting components on opposite major surfaces of the module substrate instead of adjacent positions on the same surface. The first component is mounted on the first major surface while the second component is mounted on the second major surface, effectively utilizing the third dimension (thickness direction) to separate components that would otherwise interfere with each other's signals.
2Adaptability or versatility
If a large number of components are mounted on the same major surface of the module substrate, then all components can be integrated, but the module size increases
Solution Approach 1:
The patent utilizes the thickness direction of the module substrate to distribute components across opposite surfaces. This allows multiple components to be integrated into the module while maintaining a compact footprint area, as components are arranged in the vertical dimension rather than spreading out horizontally.
Data Source
AI summary
Detection accuracy is improved with a reduced size. A radio-frequency module includes an antenna terminal, a signal input terminal, a signal output terminal, a mounting substrate, a chip inductor, and a directional coupler. The mounting substrate has a first major surface and a second major surface opposite to each other. The chip inductor is mounted on the first major surface of the mounting substrate. The chip inductor is provided in at least one of a transmitting path between the antenna terminal and the signal input terminal and a receiving path between the antenna terminal and the signal output terminal. The directional coupler is mounted on the second major surface of the mounting substrate, and at least part of the directional coupler is provided in the transmitting path.