RF Module Opposite-Side PA Layout for Signal Isolation
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Solution Overview
Problem
In compact radio frequency front-end circuits of mobile communication devices, proximity of transmission power amplifiers for different communication bands leads to intermodulation distortion and deterioration of radio frequency signal quality due to signal leakage.
Innovation Solution
A radio frequency module configuration with reception low-noise amplifiers mounted on opposite surfaces of a module board, separating transmission and reception circuits to prevent mutual interference and signal leakage, using a module board with distinct principal surfaces for each frequency band to enhance signal isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple transmitters and power amplifiers are arranged in close proximity to achieve compact module size, then device compactness is improved, but intermodulation distortion occurs due to signal leakage between adjacent power amplifiers
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacked arrangement by placing power amplifiers on different layers (first power amplifier on first main surface, second power amplifier on second main surface). This vertical separation in the third dimension effectively isolates the RF signals while maintaining compact footprint, preventing intermodulation distortion without increasing overall module volume.
Solution Approach 2:
The module is segmented into distinct functional layers with power amplifiers separated onto different main surfaces of the substrate. This segmentation physically divides the RF signal paths of different communication bands, preventing signal leakage and intermodulation while maintaining compact integration.
2Device complexity
If transmission power amplifiers of different communication bands are placed adjacent to each other, then circuit integration is improved, but signal leakage occurs leading to deterioration of radio frequency signal quality
Solution Approach 1:
The invention uses vertical stacking on opposite surfaces of the substrate to separate power amplifiers handling different communication bands. This three-dimensional arrangement maintains high circuit integration while providing sufficient isolation to prevent signal leakage and maintain signal quality.
Solution Approach 2:
The substrate acts as an intermediary barrier between the two power amplifiers mounted on opposite surfaces. This intermediate structure provides physical and electromagnetic isolation, preventing direct signal leakage while maintaining integrated circuit architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces intermodulation distortion and maintains the quality of radio frequency signals by preventing harmonic and intermodulation components from interfering with other transmission or reception circuits.
Implementation Method 1
the first reception low-noise amplifier and the second reception low-noise amplifier are mounted on opposite surfaces of the module board... separating transmission and reception circuits to prevent mutual interference and signal leakage
Data Source
AI summary
A radio frequency module includes a first transmission power amplifier configured to amplify a radio frequency signal of a first communication band, a second transmission power amplifier configured to amplify a radio frequency signal of a second communication band, and a module board which includes a first principal surface and a second principal surface on opposite sides of the module board, and on which the first transmission power amplifier and the second transmission power amplifier are mounted. The first transmission power amplifier is disposed on the first principal surface, and the second transmission power amplifier is disposed on the second principal surface.