RF Module Package Segmentation for Circuit Downsizing

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Solution Overview

Problem

Existing radio-frequency modules struggle to simultaneously downsize circuits and improve current efficiency for different communication standards, as prioritizing one requirement over the other leads to unsatisfied conditions in current designs.

Innovation Solution

A radio-frequency module with separate packages for different communication standards, where the third-receiver circuit in one package overlaps the first-receiver band and the third-transmitter circuit in another package shares a supply voltage controller with the second-transmitter circuit, allowing for downsized circuits and enhanced current efficiency by optimizing the placement and control of transmitter circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the frequency band of the first communication standard is close to the frequency band of the third communication standard, then circuit downsizing is achieved by operating a circuit for the first communication standard also as a circuit for the third communication standard, but the current efficiency of transmitter circuits cannot be improved

Engineering Contradiction:

Improvecircuit sizeVSAvoidcurrent efficiency

Core Design Contradiction:

Volume of moving objectVSUse of energy by moving object

Solution Approach 1:

The radio-frequency module is divided into multiple packages, with each package containing transmitter circuits for specific communication standards. This segmentation allows independent optimization of each package while enabling shared infrastructure across packages, resolving the contradiction between circuit downsizing and current efficiency improvement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The supply voltage controller is designed to serve multiple transmitter circuits across different packages and communication standards. By making the supply voltage controller universal, the patent achieves both circuit downsizing (through shared components) and improved current efficiency (through optimized power control for multiple standards).

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Use of energy by moving object

If a supply voltage controller is used to increase the current efficiency of the transmitter circuit, then current efficiency is improved, but the cost increases due to the high cost of the supply voltage controller

Engineering Contradiction:

Improvecurrent efficiencyVSAvoidcost

Core Design Contradiction:

Use of energy by moving objectVSEase of manufacture

Solution Approach 1:

The supply voltage controller is designed as a universal component that controls power supply for multiple transmitter circuits across different communication standards. This multi-functionality allows a single controller to serve multiple purposes, improving current efficiency while avoiding the need for separate expensive controllers for each standard, thus managing cost effectively.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

Multiple transmitter circuits from different packages and communication standards are merged into a unified power control system. By combining their power control requirements into a single supply voltage controller, the patent reduces overall system cost while maintaining improved current efficiency through centralized optimization.

Inventive Principle:

Principle #5Merging (Combining)

3Use of energy by moving object

If the transmitter circuit based on the third communication standard is disposed close to the transmitter circuit based on the second communication standard, then the single supply voltage controller can function for both, but circuit downsizing cannot be achieved

Engineering Contradiction:

Improvecurrent efficiencyVSAvoidcircuit size

Core Design Contradiction:

Use of energy by moving objectVSVolume of moving object

Solution Approach 1:

The patent segments the radio-frequency module into multiple packages, each containing transmitter circuits for specific communication standards. This segmentation allows physical separation that enables independent optimization while maintaining logical proximity for shared supply voltage control, resolving the contradiction between circuit downsizing and current efficiency improvement.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent utilizes three-dimensional packaging structures to position transmitter circuits in different spatial layers. This dimensional approach allows circuits to be physically separated for downsizing while maintaining electrical proximity for shared power control, achieving both circuit size reduction and improved current efficiency simultaneously.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11817890B2Radio-frequency module and communication device

Publication Date: 2023.11.14 MURATA MFG CO LTD

AI summary

A radio-frequency module includes a first package where a first-transmitter circuit transmits a first transmit signal in a first transmit band based on a first communication standard and a first-receiver circuit receives a first receive signal in a first receive band based on the first communication standard, and a second package where a second-transmitter circuit transmits a second transmit signal in a second transmit band based on a second communication standard and a second-receiver circuit receives a second receive signal in a second receive band based on the second communication standard. In the first package, a third-receiver circuit receives a third receive signal in a third receive band based on a third communication standard and partially overlaps the first receive band. In the second package, the third-transmitter circuit transmits a third transmit signal in a third transmit band based on the third communication standard.