RF Module Pedestal Layout for Stable Solder Bump Mounting
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Solution Overview
Problem
Existing radio frequency modules face challenges in size reduction and stable mounting due to variations in solder bump heights caused by different-sized external terminals, leading to connection failures and instability during substrate mounting.
Innovation Solution
A radio frequency module configuration featuring a pedestal-supported second component with external terminals of varying sizes, where the pedestal connects the first and second components, reducing the degree of variation in terminal sizes and enabling stable mounting by adjusting solder dimensions to match substrate lands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If external terminals of different sizes are used for mounting, then the radio frequency module can be mounted on substrates, but the solder bump heights vary causing connection failures and mounting instability
Solution Approach 1:
The patent applies local quality by providing different solder bump height specifications for different terminal types. First external terminals have first solder bumps with a first height, while second external terminals have second solder bumps with a second height that is different from the first height. This allows each terminal to have the appropriate solder bump characteristics for its specific mounting requirements, resolving the contradiction between mounting adaptability and mounting stability.
2Manufacturing precision
If the pedestal height is increased to support the second component, then the terminal size variation is reduced, but the overall module height increases
Solution Approach 1:
The patent applies local quality by implementing non-uniform solder bump heights across different terminal locations. Instead of increasing the pedestal height uniformly for all terminals, the solution provides first solder bumps of a first height for first external terminals and second solder bumps of a second height for second external terminals. This localized differentiation achieves terminal size consistency where needed while avoiding unnecessary height increases in other areas, thus resolving the contradiction between manufacturing precision and module height.
3Reliability
If solder bump heights are varied to match substrate lands, then mounting stability is improved, but the complexity of solder application increases
Solution Approach 1:
The patent applies preliminary action by pre-configuring the solder bumps with different heights before the mounting process. The first solder bumps are formed with a first height and the second solder bumps are formed with a second height in advance, allowing the radio frequency module to be mounted on substrates with different land configurations without requiring complex real-time adjustments during the soldering process. This resolves the contradiction between connection stability and solder application complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration allows for stable and efficient mounting of the radio frequency module on substrates, reducing transmission loss and enhancing heat radiation while achieving height reduction by minimizing solder height variations and maintaining consistent terminal dimensions.
Implementation Method 1
A first solder is between the first surface and the first component, a second solder is between the pedestal and the second component, and a third solder is between the first surface and the pedestal
Data Source
AI summary
A radio frequency module comprises a first component, a second component and a pedestal all supported by a first surface. The first component, the second component and pedestal all extend along a first axis perpendicular to the first surface. Along the first axis, the first component is longer than the second component and the pedestal is between the second component and the first surface. A first solder is between the first surface and the first component, a second solder is between the pedestal and the second component, and a third solder is between the first surface and the pedestal. Along a second axis which is parallel to the first surface, a first dimension of the first solder is greater than a second dimension of the second solder, anda third dimension of the third solder is greater than the second dimension.