RF Module Plated Metal Wall Body for Isolation
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Solution Overview
Problem
In mobile communication devices, electromagnetic field coupling between inductance components of transmission and reception circuits leads to decreased isolation and deterioration in reception sensitivity due to harmonic and intermodulation distortion components.
Innovation Solution
A radio frequency module with a plated metal wall body disposed between inductance elements of the transmission and reception circuits on a module board to reduce electromagnetic field coupling, using a configuration that includes transmission and reception power amplifiers, filters, and matching circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If inductance components of transmission and reception circuits are arranged close together in a small-sized module, then integration density is improved, but electromagnetic field coupling occurs between the inductance components causing isolation deterioration and reception sensitivity degradation
Solution Approach 1:
A ground electrode is introduced as an intermediary element between the first inductance component (transmission side) and the second inductance component (reception side). This ground electrode acts as a shield that interrupts the electromagnetic field coupling path, preventing harmful coupling while allowing the inductance components to be arranged in close proximity for compact module design.
Solution Approach 2:
The space between the transmission and reception circuits is segmented by introducing the ground electrode, which divides the electromagnetic field environment into separate zones. This segmentation creates an electromagnetic boundary that isolates the transmission and reception paths, reducing mutual interference while maintaining compact integration.
2Power
If transmission power amplifier operates at high power, then transmission capability is improved, but harmonic and intermodulation distortion components are generated that couple to reception circuit causing reception sensitivity deterioration
Solution Approach 1:
The ground electrode serves as a mediator that blocks the propagation of harmonic and intermodulation distortion components generated by the high-power transmission amplifier. By positioning the ground electrode between the transmission and reception circuits, it prevents these harmful frequency components from coupling into the sensitive reception path, enabling high-power transmission without compromising reception sensitivity.
Solution Approach 2:
The ground electrode structure, while primarily serving as electromagnetic shielding, also provides a reference potential plane that stabilizes the RF environment. This shielding structure converts the potentially harmful high-power transmission environment into a controlled setting where distortion components are contained and prevented from affecting the reception circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves isolation between transmission and reception sides, reducing harmonic and intermodulation distortion, thereby enhancing reception sensitivity in multiband communication devices.
Implementation Method 1
a first wall body disposed on the module board and made of plated metal. In the radio frequency module, the first wall body is disposed between the first inductance element and the second inductance element in a plan view of the module board
Data Source
AI summary
A radio frequency module includes a module board, a transmission power amplifier, a first inductance element mounted on the module board and connected to an output terminal of the transmission power amplifier, a reception low noise amplifier, a first inductance element mounted on the module board and connected to an input terminal of the reception low noise amplifier, and a wall body made of plated metal and disposed on the module board. The wall body is disposed between the first inductance element and the second inductance element.