RF Module Recessed Substrate Thermal Path
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Solution Overview
Problem
Multilayer substrates in radio-frequency modules face challenges in heat dissipation due to extended heat dissipation paths created by metallic vias extending through stacked layers, which can hinder efficient thermal management.
Innovation Solution
The implementation of a radio-frequency module configuration that includes a multilayer substrate with a recessed design, where the first semiconductor device is mounted over a recess with an anisotropic conductive resin component, and a metallic via extends through the substrate, reducing the length of the heat dissipation path and improving thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a multilayer substrate with stacked layers is used to miniaturize the module, then the module size is reduced, but the metallic via extends through multiple layers creating an extended heat dissipation path that reduces heat dissipation efficiency
Solution Approach 1:
The patent introduces a recess (void space) in the multilayer substrate that extends in the vertical dimension, allowing the metallic via to terminate at the recess bottom rather than extending through all layers. This dimensional change creates a shortcut heat dissipation path from the heat-generating component through the anisotropic conductive resin to the heat sink, bypassing the extended path through multiple substrate layers.
Solution Approach 2:
The patent introduces an anisotropic conductive resin component as an intermediary material filling the recess and bonding the heat-generating component to the heat sink. This intermediary provides a low-thermal-resistance path for heat dissipation while maintaining electrical connection, solving the heat dissipation problem created by the multilayer substrate structure.
2Area of stationary object
If components are mounted on one major face of the multilayer substrate to achieve miniaturization, then the module becomes more compact, but heat dissipation becomes more difficult due to the extended heat dissipation path through stacked layers
Solution Approach 1:
The recess structure utilizes the vertical dimension of the multilayer substrate to create a heat dissipation shortcut. By extending the recess downward from the mounting face and terminating the metallic via at the recess bottom, the heat dissipation path is shortened without reducing the mounting area on the substrate surface.
Solution Approach 2:
The patent applies local quality by creating a recess only in the region where heat-generating components are mounted, and by using anisotropic conductive resin specifically in this recessed area. This localized modification provides enhanced heat dissipation where needed without affecting the overall multilayer substrate structure or other mounting areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation capabilities, reduces manufacturing costs, and minimizes the size and profile of the radio-frequency module while maintaining effective thermal management, even when using high-heat-generating compound semiconductor substrates.
Implementation Method 1
The anisotropic conductive resin component is disposed on a bottom face of the first recess... The first semiconductor device is mounted over the bottom face of the first recess with the anisotropic conductive resin component interposed therebetween... improve the heat dissipation capability
Implementation Method 2
The first semiconductor device is connected with a metallic via. The metallic via extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face... heat is dissipated by use of the metallic via
Data Source
AI summary
A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, and an anisotropic conductive resin component. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess with the anisotropic conductive resin component interposed therebetween. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face.