RF Module Recessed Chip Inductors Height Reduction
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Solution Overview
Problem
There is a need to reduce the height of radio frequency modules while maintaining effective communication capabilities, as conventional designs often result in bulky structures due to the arrangement of components on both surfaces of multilayer wiring boards.
Innovation Solution
The radio frequency module incorporates a mounting substrate with recesses at its ends, where chip inductors are strategically placed to reduce the overall height, allowing for a more compact design without compromising performance. This configuration includes a combination of chip inductors, amplification units, and filtering components optimized for impedance matching and signal processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are arranged on both surfaces of multilayer wiring boards, then communication capabilities are maintained, but module height increases
Solution Approach 1:
The patent transitions from planar component arrangement to three-dimensional arrangement by utilizing recesses in the substrate. Chip inductors are placed in recesses formed at specific positions on the substrate surface, allowing components to be arranged in vertical layers rather than only on flat surfaces, thereby reducing the overall module height while maintaining functional capabilities
Solution Approach 2:
The patent embeds chip inductors within recesses formed in the substrate structure. The recesses are created by removing portions of the substrate, and chip inductors are then mounted within these凹陷 regions, effectively nesting components within the substrate volume rather than placing them all on external surfaces, thus reducing the module's vertical profile
2Length of stationary object
If module height is reduced, then compact design is achieved, but component arrangement becomes more difficult
Solution Approach 1:
The patent divides the substrate into multiple regions with different heights by forming recesses at specific locations. These recesses create distinct mounting zones for different components, allowing for organized and systematic component placement. The segmentation of the substrate surface into recessed and non-recessed areas simplifies the manufacturing process by providing clear guidelines for component positioning and assembly
Solution Approach 2:
The patent applies different structural characteristics to different regions of the substrate. Recesses are formed at specific positions where chip inductors need to be mounted, while other regions maintain the original substrate height and structure. This localized modification allows components to be arranged in a compact manner without complicating the overall manufacturing process, as only specific areas require recess formation
Data Source
AI summary
To provide a radio frequency module and a communication device capable of achieving reduction in height. The radio frequency module includes a mounting substrate and one or more chip inductors. The mounting substrate has a recess at least one end of both ends in a second direction orthogonal to a first direction that is a thickness direction of the mounting substrate. A second chip inductor that is at least one chip inductor of the one or more chip inductors is disposed in the recess.