3D RF Module Layout With Recessed Components for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current radio-frequency modules are limited in their ability to further miniaturize communication devices, which is essential for advancements in mobile communication technology.
Innovation Solution
A radio-frequency module design featuring a module substrate with a recessed surface, where a first circuit component is partially disposed within the recess, filled with a resin member, and a wiring layer made of a different material, with a second circuit component disposed on the wiring layer, allowing for overlapping configurations that optimize space utilization and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If circuit components are incorporated into the substrate to miniaturize the communication device, then the device size is reduced, but further miniaturization is still desired
Solution Approach 1:
The patent transitions from two-dimensional planar arrangement of circuit components to three-dimensional stacking by forming recesses in the substrate and placing components within these recesses. This vertical dimension utilization allows multiple components to occupy overlapping footprint areas, achieving further miniaturization beyond conventional planar integration.
Solution Approach 2:
The patent embeds circuit components within recesses formed in the substrate, creating a nested structure where components are housed inside the substrate volume rather than occupying surface area. This nesting approach allows the components to be contained within the substrate's three-dimensional space, reducing the overall device footprint.
2Volume of moving object
If components are disposed within recesses to reduce device size, then space utilization is improved, but manufacturing complexity increases
Solution Approach 1:
The recesses are formed in the substrate before the circuit components are mounted. This preliminary formation of recesses allows components to be placed directly into the prepared cavities, simplifying the assembly process compared to attempting to compress or force-fit components into tight spaces after substrate fabrication.
Solution Approach 2:
Resin members are introduced as intermediary materials to fill the recesses and provide mechanical support and electrical isolation for the circuit components. These resin members facilitate the integration of components within the recesses while maintaining structural integrity and reducing direct component-to-substrate complexity.
3Reliability
If wiring layers are added to connect components in three-dimensional arrangement, then electrical connectivity is improved, but wiring losses increase
Solution Approach 1:
The patent utilizes vertical wiring layers extending between different levels (substrate surface and recess interior) to connect circuit components in three-dimensional space. This vertical interconnection approach reduces the horizontal wiring length required compared to planar arrangements, thereby reducing resistive losses while maintaining electrical connectivity.
4Adaptability or versatility
If transmit and receive paths are integrated in the same module, then device functionality is improved, but isolation between paths becomes difficult
Solution Approach 1:
The patent separates transmit and receive paths by assigning them to different vertical levels within the module - transmit components are disposed on the substrate surface while receive components are placed within recesses. This vertical separation creates natural electromagnetic isolation between the two signal paths while maintaining both functionalities in a single integrated module.
Solution Approach 2:
Resin members filling the recesses serve as intermediary materials providing electrical isolation between transmit and receive paths. These resin materials with appropriate dielectric properties prevent electromagnetic coupling between the two paths, ensuring signal integrity while allowing both functionalities to coexist in the same module.
Data Source
AI summary
A radio-frequency module includes a module substrate having major surfaces that are opposite to each other, with the major surface having a recess, a first circuit component at least partially disposed within the recess, a resin member filling the recess and covering at least a portion of the first circuit component, a resin wiring layer covering the recess, and a second circuit component disposed on the resin wiring layer and electrically coupled to the first circuit component. The resin wiring layer includes a wiring portion and a resin portion that has greater strength than the resin member.