Recessed RF Module Substrate Layout for Better Heat Dissipation
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Solution Overview
Problem
Multilayer substrates in radio-frequency modules face challenges in achieving sufficient heat dissipation due to the extended length of metallic vias through stacked layers, which can impede effective heat dissipation.
Innovation Solution
The radio-frequency module incorporates a multilayer substrate with a recessed design, where the first semiconductor device is mounted over the bottom face of the recess and connected with a metallic via extending through the substrate. This configuration reduces the heat dissipation path length and improves thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metallic via extends through the entire multilayer substrate to connect components on opposite faces, then electrical connection is achieved, but heat dissipation path becomes extended and heat dissipation capability deteriorates
Solution Approach 1:
The patent divides the single through-substrate via into multiple segments: a first via in the first substrate, a second via in the second substrate, and an intermediate connection structure between them. This segmentation allows each via segment to be optimized independently, with the intermediate connection providing thermal management benefits while maintaining electrical connectivity across the stacked substrate architecture.
Solution Approach 2:
The patent transitions from a single-substrate via structure to a multi-substrate stacked architecture where vias are distributed across multiple layers. By adding the vertical stacking dimension, the patent creates intermediate thermal management interfaces between substrates, effectively reducing the thermal resistance of the overall heat dissipation path while maintaining electrical connection functionality.
2Adaptability or versatility
If multilayer substrate is made with multiple stacked layers to integrate more components, then device functionality is improved, but metallic via length increases and heat dissipation becomes difficult
Solution Approach 1:
The patent segments the multilayer substrate into multiple independent substrate layers, each with its own via structures and thermal management characteristics. This allows functional integration across layers while creating intermediate thermal interfaces that improve overall heat dissipation capability compared to a single thick substrate.
Solution Approach 2:
The patent introduces intermediate connection structures and molding compounds between stacked substrates that serve as thermal mediators. These intermediary layers provide additional thermal conduction paths and thermal management interfaces, enabling effective heat dissipation in the multi-layer architecture while maintaining electrical connectivity and component integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed configuration enhances the heat dissipation capability of the multilayer substrate, effectively managing heat generated by the semiconductor devices and reducing manufacturing complexity and costs.
Implementation Method 1
heat is dissipated by use of the metallic via
Data Source
AI summary
A radio-frequency module includes a multilayer substrate, a first semiconductor device, a second semiconductor device, a first mold layer, and a second mold layer. The multilayer substrate includes a plurality of stacked layers, and has a first major face and a second major face. The first mold layer seals the first semiconductor device. The second mold layer seals the second semiconductor device. The first major face includes a first recess. The first semiconductor device is mounted over a bottom face of the first recess. The second semiconductor device is mounted over the first major face so as to overlie the first recess. The first semiconductor device is connected with a metallic via that extends through a portion of the multilayer substrate from the bottom face of the first recess to the second major face. The first mold layer and the second mold layer are made of different materials.