RF Module Wire Bonding Without Relay Pad

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Solution Overview

Problem

The existing RF modules used in cellular phones are limited in size due to the need for relay pads to connect semiconductor chips, which occupy valuable space and hinder miniaturization efforts.

Innovation Solution

Direct wire bonding between semiconductor chips eliminates the need for relay pads, allowing for closer placement and reduced size of RF modules by connecting amplifier and control circuits without intermediate pads on the wiring board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If relay pads are used to connect semiconductor chips, then electrical connection between chips is achieved, but module size increases due to space occupation by relay pads

Engineering Contradiction:

Improveelectrical connectionVSAvoidmodule size

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The invention extracts and eliminates the relay pad component from the connection system. By directly bonding the bonding pad of the first semiconductor chip to the bonding pad of the second semiconductor chip, the intermediate relay pad is removed entirely, reducing the overall module area while maintaining electrical connection functionality.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the connection function previously distributed across multiple components (bonding pad-relay pad-bonding pad) into a direct bond between bonding pads. This consolidation eliminates the need for separate relay pad structures and reduces the total space required for inter-chip connections.

Inventive Principle:

Principle #5Merging (Combining)

2Ease of operation

If relay pads are used for chip connection, then signal transmission between amplifier and control circuits is enabled, but integration density decreases

Engineering Contradiction:

Improvesignal transmissionVSAvoidintegration density

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The relay pad, which acted as an intermediate signal transmission component, is extracted and removed from the system. The signal path is simplified to a direct connection between the amplifier circuit on the first chip and the control circuit on the second chip, improving integration density while maintaining signal transmission capability.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If relay pads are employed in the wiring board, then electrical pathways are established, but space for component placement is reduced

Engineering Contradiction:

Improveelectrical pathwayVSAvoidcomponent placement space

Core Design Contradiction:

ReliabilityVSArea of moving object

Solution Approach 1:

The relay pad structures that occupied valuable wiring board space are extracted and eliminated. The direct bonding approach establishes electrical pathways without requiring intermediate pad structures on the wiring board, thereby increasing the available space for component placement and module miniaturization.

Inventive Principle:

Principle #2Taking out (Extraction)

Data Source

PatentUS8546939B2RF module including control IC without the aid of a relay pad

Publication Date: 2013.10.01 MURATA MFG CO LTD

AI summary

A technology is provided so that RF modules used for cellular phones etc. can be reduced in size. Over a wiring board constituting an RF module, there are provided a first semiconductor chip in which an amplifier circuit is formed and a second semiconductor chip in which a control circuit for controlling the amplifier circuit is formed. A bonding pad over the second semiconductor chip is connected with a bonding pad over the first semiconductor chip directly by a wire without using a relay pad. In this regard, the bonding pad formed over the first semiconductor chip is not square but rectangular (oblong).