RF Module Shield Structure for Better Heat Dissipation
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Solution Overview
Problem
Existing radio frequency modules require further improvement in heat dissipation to effectively manage heat generated by electronic components.
Innovation Solution
A radio frequency module design featuring a module substrate with circuit components on its principal surface, a resin member covering side surfaces, a metal layer in contact with the resin and circuit components, and an engraved portion on the top surface of the components to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal layer is added to cover the resin member and circuit components, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The metal layer serves multiple functions simultaneously: it acts as a heat sink to dissipate heat from circuit components, provides electromagnetic shielding to protect against RF interference, and serves as a mechanical reinforcement layer. This multi-functionality improves heat dissipation without proportionally increasing device complexity.
Solution Approach 2:
The patent combines the heat dissipation function and electromagnetic shielding function into a single metal layer structure. By merging these functions into one component rather than separate elements, the design achieves improved heat dissipation while minimizing the increase in overall structural complexity.
2Temperature
If the metal layer is made thicker to improve heat dissipation, then heat conduction is improved, but manufacturing precision requirements increase
Solution Approach 1:
Instead of uniformly increasing the metal layer thickness, the patent employs varying thickness parameters across different regions. The metal layer is thicker in areas with higher heat generation and thinner in low-heat areas, optimizing heat conduction while maintaining manufacturability. This parameter variation allows achieving effective heat dissipation without requiring extremely tight thickness control specifications.
3Temperature
If the metal layer is made thicker to improve heat dissipation, then heat dissipation is improved, but device weight increases
Solution Approach 1:
The metal layer is designed with spatially varying thickness, being thicker only in regions where heat dissipation is most critical (such as near power amplifiers or high-power components). This local quality approach concentrates the heat dissipation function where needed while minimizing the overall weight compared to a uniformly thick design.
Solution Approach 2:
The metal layer is segmented into multiple sub-layers or regions with different thicknesses rather than using a single uniform thickness. This segmentation allows the design to achieve effective heat dissipation in critical areas while reducing material usage and weight in less critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases the contact area between the metal shield layer and circuit components, facilitating heat conduction and preventing peeling, resulting in a radio frequency module with improved heat dissipation, reliability, and durability.
Implementation Method 1
a metal layer in contact with a top surface of the resin member and a top surface of the one or more circuit components
Data Source
AI summary
A radio frequency module includes a module substrate having a principal surface, one or more circuit components disposed on a principal surface side, a resin member disposed on the principal surface side and covering a side surface of the one or more circuit components, a metal shield layer in contact with a top surface of the resin member and a top surface of the one or more circuit components, and an engraved portion provided on the top surface of the one or more circuit components.