RF Module Shield Layer Heat Dissipation
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Solution Overview
Problem
Existing radio frequency modules face challenges in heat dissipation, leading to increased temperatures of electronic components which can affect their performance and stability.
Innovation Solution
The proposed radio frequency module includes a mounting substrate, first and second electronic components, a resin layer, and a shield layer. The shield layer is in contact with the second main surface of both substrates, enhancing heat dissipation by covering the resin layer, electronic components, and substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are mounted on the first main surface of the mounting substrate, then the radio frequency module can be assembled, but heat dissipation becomes insufficient leading to increased component temperatures
Solution Approach 1:
The invention transitions from planar heat dissipation on the first main surface to three-dimensional heat dissipation by extending the shield layer to contact the second main surfaces of substrates. This vertical dimension addition creates multiple heat dissipation pathways, allowing heat to escape from both the first and second main surfaces of the mounting substrate, effectively reducing component temperatures while maintaining reliable assembly.
Solution Approach 2:
The shield layer serves multiple functions simultaneously: it provides electromagnetic shielding and acts as a heat dissipation structure by contacting the second main surfaces of substrates. This multi-functionality resolves the contradiction by enabling the same structural element to address both assembly requirements and thermal management needs, improving reliability without compromising temperature control.
2Temperature
If a shield layer is added to cover the resin layer and electronic components, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The shield layer is designed to perform dual functions: electromagnetic shielding and heat dissipation. By making the shield layer contact the second main surfaces of substrates, it creates additional heat dissipation pathways without requiring separate thermal management components. This multi-functionality improves heat dissipation while avoiding the complexity increase that would result from adding dedicated cooling structures.
Solution Approach 2:
The invention merges the electromagnetic shielding function and heat dissipation function into a single integrated shield layer structure. Instead of adding separate components for thermal management, the shield layer is extended to contact substrate second main surfaces, combining multiple benefits into one structural element and thereby improving heat dissipation without proportionally increasing device complexity.
3Temperature
If the shield layer contacts the second main surface of substrates, then heat dissipation is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The shield layer contact structure is segmented to contact multiple second main surfaces of different substrates rather than requiring a single precise contact point. This segmentation distributes the positioning requirements across multiple contact areas, reducing the overall manufacturing precision burden while maintaining effective heat dissipation pathways from various heat-generating components.
Solution Approach 2:
The shield layer serves as both an electromagnetic shield and a thermal conduction path. Its extended structure that contacts second main surfaces of substrates is designed with tolerance accommodation, allowing it to fulfill both shielding and heat dissipation functions without requiring extremely tight manufacturing tolerances, thus enhancing heat dissipation while managing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation, stabilizes the temperature of the lithium niobate or lithium tantalate substrates, and maintains the characteristics of the acoustic wave filters, thereby enhancing the overall performance and reliability of the radio frequency module.
Implementation Method 1
The shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate, enhancing heat dissipation
Data Source
AI summary
A radio frequency module includes a mounting substrate, a first electronic component, a second electronic component, a resin layer, and a shield layer. The resin layer covers outer peripheral surfaces of the first electronic component and the second electronic component. The first electronic component includes a first substrate having first and second main surfaces opposed to each other, and a first circuit section formed on the first main surface side of the first substrate. The second electronic component includes a second substrate having first and second main surfaces opposed to each other, and a second circuit section formed on the first main surface side of the second substrate. A material of the first substrate and a material of the second substrate are the same. The shield layer is in contact with the second main surface of the first substrate and the second main surface of the second substrate.