RF Module Shield Wall Layout for Noise Reduction and Mounting Area

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Solution Overview

Problem

Conventional radio frequency modules do not sufficiently reduce noise interference and require space for shield walls, limiting the mounting area for components.

Innovation Solution

A radio frequency module design featuring a module substrate with metal walls set to ground potential, covering components and a metal layer, ensuring a mounting area while reducing noise interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a shield wall is disposed on the wiring board to suppress noise interference between components, then the noise interference is reduced, but the mounting area for components is reduced

Engineering Contradiction:
Improvenoise interferenceVSAvoidmounting area
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The invention transitions the shield wall from a planar structure on the wiring board to a three-dimensional structure extending upward from the component. The metal wall rises vertically from the component surface, creating a spatial barrier that blocks electromagnetic noise without occupying additional planar mounting area on the wiring board.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The metal wall is integrated with the component structure, with the shield wall effectively nested within or attached to the component body. This integration allows the shielding function to be embedded within the existing component footprint, eliminating the need for separate shield wall space on the wiring board.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Object-affected harmful factors

If a shield wall is disposed between adjacent components to reduce noise interference, then the electromagnetic coupling is suppressed, but the device complexity increases

Engineering Contradiction:
Improveelectromagnetic couplingVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The shielding function is merged with the component structure itself. The metal wall is integrated into the component assembly, combining the component's functional role with the shielding role into a single unified structure, thereby reducing overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The metal wall structure serves multiple functions simultaneously: it provides mechanical support as part of the component assembly and provides electromagnetic shielding. This multi-functionality reduces the need for separate dedicated shield wall structures, simplifying the overall device design.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances noise interference reduction and maintains a sufficient mounting area for components by using metal walls to shield electromagnetic coupling.

Implementation Method 1

a first metal wall disposed on an upper surface of the first component and set to ground potential

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS12445159B2Radio frequency module and communication device
Publication Date: 2025.10.14 MURATA MFG CO LTD
  • US12445159B2 patent drawing
  • US12445159B2 patent drawing
  • US12445159B2 patent drawing

AI summary

A radio frequency module includes a module substrate, a first component disposed on a principal surface side of the module substrate, a metal shield wall disposed on an upper surface of the first component and set to ground potential, a resin member covering the principal surface of the module substrate, the upper surface and a side surface of the first component, and a side surface of the metal shield wall, and a metal shield layer set to the ground potential and covering an upper surface of the resin member. An upper end of the metal shield wall is in contact with the metal shield layer. The first component includes a first terminal and a second terminal both connected to the module substrate. When the principal surface is viewed in plan, the metal shield wall is disposed between the first terminal and the second terminal.